Nutool, Inc.

Asm Nutool, Inc.

Novellus Systems Incorporated

Solopower, Inc.

Active Layer Parametrics, Inc.

Jalal Ashjaee

Bulent Mehmet Basol

Homayoun Talieh

Konstantin Volodarsky

Douglas W Young

Cyprian Emeka Uzoh

Boguslaw Nagorski

Abhijeet Joshi

Bernard Frey

Boris T Govzman

Rimma Volodarsky

Serkan Erdemli

Steve Kuskie

Kiet Tran

Srinivasan M Komandur

A method for electrically characterizing a layer disposed on a substrate and electrically insulated from the substrate is disclosed. The method can include forming a test pattern, contacting the test pattern with electrical contact elements at contact regions, and measuring an electrical parameter of the layer by passing a first set of test currents between contact regions. The test pattern can be formed by pushing a pattern forming head against a top surface of the layer, introducing a first fluid into the cavity, and converting the sacrificial portion of the layer into an insulator using the first fluid and forming the test pattern under the test-pattern-shaped inner seal.

Methods and apparatus for test pattern forming and film property measurement

Methods, tools and systems for full characterization of thin and ultra-thin layers employed in advanced semiconductor device structures are disclosed.

Methods and systems for material property profiling of thin films

A deposition method and a system are provided to deposit a CdS buffer layer on a surface of a solar cell absorber layer of a flexible workpiece from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited from the deposition solution while the flexible workpiece is elastically shaped by a series of shaping rollers to retain the process solution on the solar cell absorber layer and while the flexible workpiece is heated by contacting to a heated liquid that the shaping rollers are fully or partially immersed. The flexible workpiece is elastically shaped by pulling a back surface of the flexible workpiece into surface cavity of the shaping rollers using magnetic force.

Roll-to-roll processing method and tools for electroless deposition of thin layers

The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

Method and apparatus for stringing thin film solar cells

A deposition method and a system are provided to deposit a CdS buffer layer on a surface of a solar cell absorber layer of a flexible workpiece from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited from the deposition solution while the flexible workpiece is heated and elastically shaped by a heated shaping plate to retain the process solution on the solar cell absorber layer. The flexible workpiece is elastically shaped by pulling a back surface of the flexible workpiece into a cavity area in the heated shaping plate using an attractive force.

Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

Apparatus for processing surface of workpiece with small electrodes and surface contacts

An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

System for electropolishing and electrochemical mechanical polishing

A carrier head for holding a workpiece during processing of a workpiece surface is provided. The carrier head includes a carrier housing, a base and a pressure member. The base is configured to hold the workpiece and is movable with respect to the carrier housing. The pressure member is between the base and the carrier housing and is configured to induce the base to apply a predetermined force onto the process surface.

Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing

The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.

Edge and bevel cleaning process and system

An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

Integrated system for processing semiconductor wafers

The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

Apparatus of sealing wafer backside for full-face processing

An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.

The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.

Method and apparatus of sealing wafer backside for full-face electrochemical plating

The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Growing community of inventors

Cupertino, CA, United States of America

Jalal Ashjaee