Aptiv Technologies Limited

Aptiv Technologies Ag

Jakub Korta

Marcel Fruend

Tomasz Dolot

Pawel Skruch

Volker Klink

Klaus Kaufmann

Peter Reinhold

Tobias Merten

Marcin Pietras

Jakub Zborowski

Grzegorz Puchala

Waldemar Wodecki

Lukasz Stanek

Michal Wisniowski

Tobias Richter-Brockmann

Marcel Fründ

Stanek Lukasz

Disclosed is a coolant fluid manifold for coupling to a cold plate. The manifold includes an input channel including an inlet and an outlet. The inlet is configured to receive input coolant fluid. The input channel includes a guide element that projects from a wall of the input channel. The guide element is configured to guide fluid flow from the outlet.

Manifold for a coldplate cooling system

A manifold of a cooling system includes an inlet channel and an outlet channel designed to connect to multiple plates of a heat exchanger. The inlet and outlet channels include a junction portion, a connection portion, and a transfer portion. The junction portion includes opposing inclined contact surfaces that are inclined relative to a horizontal plane of the plates and mate with corresponding inclined contact surfaces of the plates. The connection portion accepts coolant hoses. The transfer portion is located between the junction portion and connection portions.

Inlet and outlet channels for a heat exchanger

A rack assembly unit for mounting a control unit to a vehicle rack system is provided; a rack chassis and a tray are configured to receive the control unit for coupling to a vehicle system. The tray is movably coupled to the rack chassis at a coupling mechanism, which provides for movement of the tray relative to the rack chassis between open and closed positions. At the open position, the tray is spaced apart from rack chassis to facilitate user access to the tray and receiving the control unit therein. At the closed position, the tray is located fully inserted relative to the rack chassis and such that the control unit located in the tray is provided at a control unit operating position thermally coupled to a cold plate of a cooling system to provide for cooling of components of the control unit.

Rack with trays for plug-in automotive control units

This document describes a cooling device for cooling a heatsink having a plurality of cooling fins provided on a heatsink base. The cooling device includes a centrifugal fan having a fan inlet and a fan outlet, a support for mounting the fan above the heatsink, and a baffle locatable between the support and the heatsink base. The baffle defines an inlet pathway for feeding air between the cooling fins over the heatsink base to the fan inlet and an outlet pathway for expelling air from the fan outlet.

Cooling device and heatsink assembly incorporating the same

A passive flow divider for providing outflows is described. The passive flow divider includes at least one inlet for an inflow and a plurality of outlets for said outflows, a housing enclosing a main partition that separates an intake space and a discharge space, a common end located at an interface between the intake space and the discharge space, and a baffle arranged in the intake space between said inlet and the common end. The passive flow divider further includes a plurality of distribution chambers arranged in the discharge space and adjacent to each other, each distribution chamber being arranged to lead an outflow from the common end to one of the outlets.

Passive flow divider and liquid cooling system comprising the same

The present invention relates to a heat transfer device, the heat transfer device includes a first plate like structure, and a second plate like structure, with the second plate like structure projecting from the first plate like structure, wherein both the second plate like structure and the first plate like structure each comprise one or more layers of graphite.

Heat transfer device

Electronic unit comprises an housing comprising a top cover; a printed circuit board mounted inside the housing and comprising at least a first heating source element on the top layer of the printed circuit board; the top cover comprises at least a first opening; the electronic unit comprises at least a first thermally conductive insert element distinct from the housing and extending from its top extremity arranged around the first opening, to its bottom extremity in thermal contact with the first heating source element such that heating dissipation of the first heating source element is allowed; fixing means configured to entirely fix the top extremity of the first thermally conductive insert element with the top cover around the first opening.

Thermally conductive insert element for electronic unit

An electronic device includes a rear end and a front end of a first group of fins respectively defining an air inlet and an air outlet of the first group, a rear end and a front end of a second group of fins respectively defining an air outlet and an air inlet of the second group, means adapted to generate a flow of air between the plurality of fins of the first group from the air inlet to the air outlet of the first group at least one air deflector arranged facing the air outlet of the first group and configured to orient the flow of air toward the air inlet of the second group so that the flow of air is able to flow between the fins of the second group from the air inlet to the air outlet of the second group.

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Cracow, Poland

Jakub Korta