Continental Teves, Ag and Company Ohg

Conti Temic Microelectronic Gmbh

Continental Automotive Gmbh

Other

Schaeffler Technologies Ag & Co .kg

Continental Aktiengesellschaft

Temic Telefunken Microelectronic Gmbh

Continental Teves Ag & Ohg

Continental Automotive Technologies Gmbh

Strunk Connect Automated Solutions Gmbh & Co. Kg

Jakob Schillinger

Dietmar Huber

Lothar Biebricher

Michael Schulmeister

Svenja Raukopf

Stefan Günthner

Thomas Fischer

Manfred Goll

Martin Watzlawik

Edmond De Volder

Andreas Doering

Georg Weber

Henryk Frenzel

Stephan Risch

Hilmar Müller

Marco Benner

Karl-Heinz Scherf

Günther Romhart

Jens Heim

Jen-Huang Albert Chiou

Klaus Rink

Wolfgang Jöckel

Klaus Schirmer

Adrian Cyllik

Franz Foerg

Martin Haverkamp

Lothar Weichenberger

Martin Throm

Jürgen Gierl

Frank Grunwald

Joerg Lehmann

Ulrich Schrader

Matthias Viering

Gerhard Sticksel

Wilfried Babutzka

Jörg Lehmann

Yann Dinard

David Manfredi

Dirk Theobald

Joerg Moestl

Karl-Heinz Hahn

Joachim Hrabi

Andreas Döring

Gúnter Fendt

Rainer Von Lutz

Jörg Möstl

Waldemar Baumung

Gernot Sikora

Stefan GÜNTHNER

Uwe Keil

A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

Potted electronic module with improved adhesion of potting compound

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Structure-borne noise decoupling on sensors working with transmitter fields

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Sensor production by holding the intermediate injection-molded part

A method for establishing a plug connection, and a method for strengthening a plug connection, wherein a connecting zone is welded with a laser beam which passes through a surrounding housing owing to transparency.

Method for producing a plug connector, method for amplifying a plug connector and device

A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Sensor element for a motor vehicle

The sensor for detecting the position of a generator element which outputs a position-dependent physical variable, the sensor includes a transducer for converting the physical variable into an electric generator signal, a circuit on a wiring support for receiving the generator signal from the transducer and outputting a measurement signal that corresponds to the generator signal and a protective compound which at least partially surrounds the transducer and the wiring support, thus retaining the transducer on the wiring support.

Protective compound-enveloped sensor for detecting the position of an encoder element

The invention relates to a method for producing a connecting element, wherein electrical connections are defined by selective stamping-out. The invention further relates to a connecting element produced in this way and to a sensor arrangement having a connecting element of this kind.

Method for the production of a connecting element, connecting element, and sensor arrangement

A sensor for detecting a physical variable, including: &#x2014;a sensor element for outputting an electrical signal dependent on the physical variable, &#x2014;a substrate carrying the sensor element, &#x2014;a printed circuit board, conducting the electrical signal, on the substrate, and &#x2014;an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, &#x2014;wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.

Sensor with symmetrically embedded sensor elements

A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.

Electric conductor track, method, and use

A method for producing a coil as a measurement transmitter for a sensor, including: providing electrical connections and a magnetic core for the coil, forming a coil former around the magnetic core in such a way that the magnetic core is at least partially enclosed by the coil former and the electrical connections are held by the coil former, winding at least one coil wire onto the formed coil former, and connecting the wound coil wire to the electrical connections.

Method for producing a coil as measuring pickup for a sensor

A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Method for encasing an electric unit and electrical structural element

A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.

Neutral part for a client-specific adaptable sensor

A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including&#x2014;a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface, &#x2014;wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.

Adapter with embedded filter components for sensors

An electronic device including: an electronic circuit accommodated in a circuit housing having a first thermal expansion coefficient, and a molded body which surrounds the circuit housing, the body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The molded body is fixed to the circuit housing at least at two different mutually spaced fixing points on the circuit housing.

Electronic device and method for producing an electronic device

A method is provided for producing an electronic module that includes an electronic assembly with a conductor which is arranged in a housing, and which includes an electrical contact guided out through the housing wall. In the method, a protective layer is removed from an area of the conductor by ablation, and then a potting or casting compound is introduced into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

Method of producing a potted electronic module

Growing community of inventors

Gaimersheim, Germany

Jakob Schillinger