Voith Patent Gmbh

Voith Gmbh

Hartmann & Laemmle Gmbh & Co. Kg

Jakob Hermann

Eckehart Schulze

A piston slide valve including a valve housing, a piston slide mounted movably in the valve housing, which is reciprocally movable in the valve housing and configured to manipulate a fluid flow, and a valve drive. The valve drive includes a rotatable drive shaft, which is mechanically connected to the piston slide via a mechanical coupling. The mechanical coupling includes an actuating element which is eccentrically mounted on the rotatable drive shaft and which engages with a coupling piece that is attached to a radial outside of the piston slide, wherein either the actuating element has a spherical outer surface, which engages into said cylindrical opening of said coupling piece, or the coupling piece has an outer surface, which engages into a cylindrical opening of the actuating element.

Piston slide valve

A switching or proportional valve has a valve drive, a valve body actuated by the valve drive, and at least one valve seat that, together with the valve body, delimits a flow cross-section for a flow medium conducted through the valve, wherein the flow cross-section is variable depending on the position of the valve body relative to the valve seat. The valve drive may be a rotary drive having a rotatable actuator, the actuator being coupled to the valve body in such a manner that the position of the valve body relative to the valve seat changes depending on the rotary position of the actuator. An eccentric element is rotationally related with the actuator. A spring-actuated return device with a plunger pressed by a spring against the eccentric element acts to return the eccentric element and the actuator to a starting position.

Pilot valve and/or proportional valve

A device for integrally joining a metal block ( &prime;) that can consist of a number of plates, by hard-soldering or brazing. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps ( ; j&equals;1, 2, . . . , n&minus;1) located between adjacent segment plates ( ; i&equals;1, 2, . . . , n). At least one capillary solder inflow path ( ) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder or braze material ( ), which melts as the stack ( ) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps ( ; j&equals;1, 2, . . . , n&minus;1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates ( ) that face towards each other.

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Dettenhausen, Germany

Jakob Hermann