Taiwan Semiconductor Manufacturing Comp. Ltd.

Jake Yeh

Wen-Ting Chu

Di-Son Kuo

Chia-Ta Hsieh

Chuan-Li Chang

Sheng-Wei Tsaur

Chrong-Jung Lin

Chung-Li Chang

Chia-Da Hsieh

Within both a method for fabricating a split gate field effect transistor and the split gate field effect transistor fabricated employing the method, there is employed a patterned silicon nitride barrier dielectric layer formed covering a first portion of a floating gate and a first portion of a semiconductor substrate adjacent the first portion of the floating gate. Within the first portion of the semiconductor substrate there is eventually formed a source/drain region, and more particularly a source region, when fabricating the split gate field effect transistor. The patterned silicon nitride barrier dielectric layer inhibits when fabricating the split gate field effect transistor ion implant damage of the floating gate and oxidative loss of a floating gate electrode edge.

Split gate field effect transistor (FET) device employing dielectric barrier layer and method for fabrication thereof

Within both a split gate field effect transistor (FET) device and a method for fabricating the split gate field effect transistor (FET) device there is employed a doped polysilicon floating gate electrode having an central annular portion having a higher dopant concentration than a peripheral annular portion of the doped polysilicon floating gate electrode. The higher dopant concentration within the central annular portion of the doped polysilicon floating gate electrode provides enhanced programming speed properties of the split gate field effect transistor (FET) device. The lower dopant concentration within the peripheral annular portion of the doped polysilicon floating gate electrode provides enhanced erasing speed properties within the split gate field effect transistor (FET) device under certain circumstances of fabrication of the split gate field effect transistor (FET) device.

Split gate field effect transistor (FET) device employing non-linear polysilicon floating gate electrode dopant profile

Within a method for fabricating a split gate field effect transistor (FET) within a semiconductor integrated circuit microelectronic fabrication, there is employed a sacrificial self aligned spacer layer which defines a control gate electrode channel within the split gate field effect transistor (FET). The sacrificial self aligned spacer layer is employed as part of an ion implantation mask employed for forming a source/drain region adjoining the control gate electrode channel within the split gate field effect transistor (FET). The sacrificial self aligned spacer layer is stripped from over the control gate electrode channel prior to forming over the control gate electrode channel a control gate electrode within the split gate field effect transistor.

Sacrificial self aligned spacer layer ion implant mask method for forming a split gate field effect transistor (FET) device

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Jake Yeh