International Business Machines Corporation

Jaimal M Williamson

Mukta G Farooq

Evan G Colgan

Michael A Gaynes

Da-Yuan Shih

Hilton T Toy

David L Edwards

Sung Kwon Kang

Bruce Kenneth Furman

Frank Louis Pompeo

Steven Paul Ostrander

Glenn Graham Daves

Donald W Henderson

A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

Fluidic cooling systems and methods for electronic components

Growing community of inventors

Wappingers Falls, NY, United States of America

Jaimal M Williamson