Epistar Corporation

Jai-Tai Kuo

Min-Hsun Hsieh

Chi-Chih Pu

Yih-Hua Renn

Wei-Kang Cheng

Tzu-Hsiang Wang

Biing-Jye Lee

Chang-Hseih Wu

Chang-Hsieh Wu

Tsun-Kai Ko

Shou-Lung Chen

Lung-Kuan Lai

Chien-Liang Liu

Chen-Yu Wang

Sheng-Bo Wang

Yao-Zhong Liu

Chao-Kai Chang

Ya-Wen Lin

Po-Chang Chen

Yi-Chao Lin

Sheng-Che Chiou

Chiao Fu

Pei-Yu Li

Yi-Ru Shen

Shu-Han Yang

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

Light-emitting device and light-emitting apparatus comprising the same

A voltage converter circuit, comprising: a bridge rectifier; a first transistor, having a first end, a second end and a third end; a second transistor, having a first end and a second end; wherein the first end of the first transistor and the first end of second transistor are electrically connected to bridge rectifier, and the second end of the first transistor is electrically connected to the first end of the second transistor; and a Zener diode, connected between the third end of the first transistor and the second end of the second transistor.

Voltage converter circuit for converting AC voltage to DC voltage

A light emitting apparatus includes a housing, a connector, a light source, a control module board, and an antenna. The housing includes an inner space. The light source is located in the inner space. The control module board is located in the connector, wherein an accommodation space is formed by the housing and the control module board. The antenna is located in the accommodation space.

Light emitting apparatus having antenna located in accommodation space formed by housing and control module

A light-emitting device includes a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall.

Light-emitting device

A substrate includes a first metal layer, a second metal layer, a third metal layer and an insulation layer surrounding the first metal layer, the second metal layer and the third metal layer. The first power component is electrically connected to the first metal layer. The second power component is electrically connected to the second metal layer. The shortest distance between the first metal layer exposed to a second surface of the insulation layer and the second metal layer exposed to the second surface is a first distance, the shortest distance between a first metal layer of the insulation layer exposed to the first surface and the second metal layer exposed to the first surface is a second distance, and a ratio value of the first distance to the second distance ranges between 1.25 and 1.4.

Power device having a substrate with metal layers exposed at surfaces of an insulation layer and manufacturing method thereof

A light-emitting module includes a housing, a flexible film, and a protection portion. The housing includes a plurality of light-emitting units arranged in a matrix configuration and at least a switch electrically connected to at least one of the plurality of light-emitting units. The flexible film is detachably coupled to the housing. The protection portion covers the plurality of light-emitting units.

Therapeutic light-emitting module

A light-emitting device has a stabilizing-current circuit, a current source having a high electron mobility transistor, and a light source electrically connected to the stabilizing-current circuit and the current source.

A light-emitting module includes a carrier, a plurality of light-emitting units, and a protection layer. The carrier has a lighting portion and an extending portion. The plurality of light-emitting units is disposed on the lighting portion. The protection layer covers the plurality of light-emitting units and the lighting portion, and exposes the extending portion.

This disclosure discloses a light-emitting device. The light-emitting device includes: a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall.

An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.

Electronic device

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.

Light-emitting device with metal bump

Light emitting device with an adhered heat-dissipating structure

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.

Growing community of inventors

Hsinchu, Taiwan

Jai-Tai Kuo