Samsung Electronics Co., Ltd.

Jaewook Yoo

Seungho Lee

Eunah Kim

Jangho Kim

Jaeneung Lee

Chulyong Cho

Ji-gwang Kim

Sangmin Hyun

Sungjin Ann

Sung Jin Ahn

Bongkun Shin

Kyubok Lee

Dong Hee Won

Donghee Won

Minho Lee

KyoungHoon Kim

Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

Package-on-package (POP) type semiconductor packages

Television receiver

Growing community of inventors

Seoul, South Korea

Jaewook Yoo