Stats Chippac Pte. Ltd.

JaEun Yun

WonJun Ko

DaeSik Choi

Jong Wook Ju

Hye Ran Lee

Byung Joon Han

HunTeak Lee

Sungmin Song

Taeg Ki Lim

SeungYong Chai

SungYoon Lee

TaegKi Lim

A semiconductor wafer contains a plurality of first semiconductor die. The semiconductor wafer is mounted to a carrier. A channel is formed through the semiconductor wafer to separate the first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. An encapsulant is deposited over the carrier and first semiconductor die and into the channel while a side portion and surface portion of the second semiconductor die remain exposed from the encapsulant. A first conductive via is formed through the encapsulant in the channel. A second conductive via is formed through the encapsulant over a contact pad of the first semiconductor die. A conductive layer is formed over the encapsulant between the first and second conductive vias. An insulating layer is formed over the conductive layer and encapsulant. The carrier is removed. An interconnect structure is formed over the first conductive via.

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

A semiconductor wafer contains first semiconductor die. TSVs are formed through the semiconductor wafer. Second semiconductor die are mounted to a first surface of the semiconductor wafer. A first tape is applied to on a second surface of the semiconductor wafer. A protective material is formed over the second die and first surface of the wafer. The protective material can be encapsulant or polyvinyl alcohol and water. The wafer is singulated between the second die into individual die-to-wafer packages each containing the second die stacked on the first die. The protective material protects the wafer during singulation. The die-to-wafer package can be mounted to a substrate. A build-up interconnect structure can be formed over the die-to-wafer package. The protective material can be removed. Underfill material can be deposited beneath the first and second die. An encapsulant is deposited over the die-to-wafer package.

Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation

A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the interconnect structure. Bumps are formed over the interconnect structure. A protective coating material is deposited over the insulating layer and saw street. A lamination tape is applied over the coating material. A portion of a back surface of the semiconductor wafer is removed. A mounting tape is applied over the back surface. The lamination tape is removed while leaving the coating material over the insulating layer and saw street. A first channel is formed through the saw street extending partially through the semiconductor wafer. The coating material is removed after forming the first channel. A second channel is formed through the saw street and the mounting tape is removed to singulate the semiconductor wafer.

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.

Integrated circuit packaging system with heat spreader and method of manufacture thereof

An integrated circuit package in package system includes: providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires; mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film; and encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.

Growing community of inventors

Kyounggi, South Korea

JaEun Yun