Industry-University Cooperation Foundation Hanyang University

Jaeuk Lee

Seungmin Lee

Junghwan Kim

Jinho Ahn

Seongchul Hong

Jungsik Kim

Kilbock Lee

A pellicle for EUV lithography is provided. The pellicle for EUV lithography may improve strength of a pellicle film by having a strength reinforcing layer including a first coupling layer and a carbon nanostructure disposed on a first inorganic layer, the first coupling layer here increase coupling strength between the first inorganic layer and the strength reinforcing layer, and a strength reinforcing layer including a carbon nanostructure. Also, a pellicle for EUV lithography according to another embodiment and a method of fabricating the same are provided. The pellicle for EUV lithography includes a plurality of holes and is a porous thin film made of a material with an extinction coefficient less than or equal to 0.02, and a diameter of the holes is less than or equal to 1 &#x3bc;m. Accordingly, improved strength is achievable because thickness may be made large with still having high EUV transmission.

Growing community of inventors

Yangsan-si, South Korea

Jaeuk Lee