Samsung Electronics Co., Ltd.

Jaesung Byun

Hyunwoo Lee

Youngwook Kim

Sangmin Kim

Sangkyung Lee

Chuljun Park

Junhyuk Chang

Hyunjae Kang

Yongjun Ahn

Ginam Park

Jeongjae Bang

A transfer apparatus according to the disclosure includes a mast portion including a base portion, and a protrusion portion protruding from the base portion, and a plurality of shuttles configured to move along the mast portion, thereby transferring a carrier. The mast portion includes a first magnet track fixed to a first sidewall of the protrusion portion, and a second magnet track fixed to a second sidewall of the protrusion portion. Each of the plurality of shuttles includes a first coil portion adjacent to the first magnet track in a horizontal direction, and a second coil portion adjacent to the second magnet track in the horizontal direction. The protrusion portion, the first magnet track, and the second magnet track are disposed between the first and second coil portions.

Parallel transfer apparatus

A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.

Transfer apparatus having link arms and stockers having the same

Growing community of inventors

Suwon-si, South Korea

Jaesung Byun