Samsung Electronics Co., Ltd.

Jaemin Ha

Myungsun Choi

Soonam Park

Dooyoung Gwak

Janggyoo Yang

An operation method of an etching apparatus includes transferring, from a load lock chamber to a process chamber, a substrate on which an etching target layer is formed, first etching the etching target layer on the substrate in a first etching time, transferring the substrate to a storage location in a state in a vacuum state, intermediate cleaning the process chamber in a first cleaning time, transferring the substrate from the storage location to the process chamber, second etching the etching target layer on the substrate in a second etching time, and returning the substrate to the load lock chamber. The etching target layer is formed in a predetermined etching pattern by the first etching and the second etching.

Growing community of inventors

Suwon-si, South Korea

Jaemin Ha