Samsung Electronics Co., Ltd.

Fine Semitech Corp.

Jaehyuck Choi

Byunggook Kim

Munja Kim

Inkyun Shin

Yongseok Jung

Jong Keun Oh

Sungwon Kwon

Roman Chalykh

Hyungho Ko

Hwanchul Jeon

JunYoul Choi

Mun Ja Kim

Sungyong Cho

Jongju Park

Byungchul Yoo

Han-Shin Lee

Myungjun Kim

Jeonghwan Min

Jikang Kim

Kyoungchae Seo

Jeongsu Yang

Donghoon Chung

Ikjun Kim

A pellicle for lithography processes, including extreme ultraviolet (EUV) lithography may mitigate thermal accumulation in a membrane of the pellicle. The pellicle includes a membrane and at least one thermal buffer layer on at least one surface of the membrane. An emissivity of the thermal buffer layer may be greater than an emissivity of the membrane. A carbon content of the thermal buffer layer may be greater than a carbon content of the membrane. Multiple thermal buffer layers may be on separate surfaces of the membrane, and the thermal buffer layers may have different properties. A capping layer may be on at least one thermal buffer layer, and the capping layer may include a hydrogen resistant material. A thermal buffer layer may extend over some or all of a surface of the membrane. A thermal buffer layer may be between at least two membranes.

Pellicle for preventing thermal accumulation and extreme ultra-violet lithography apparatus having the same

A pellicle including a water-soluble adhesive and a photomask assembly including the pellicle are provided. A pellicle may include a membrane, a pellicle frame, and a water-soluble adhesive disposed on the pellicle frame. The water-soluble adhesive may be prepared by a mixture including a water-soluble acrylic adhesive material in an amount of about 40% to about 55% by weight of the mixture, water or a solution of water and alcohol in an amount of about 40% to about 55% by weight of the mixture, and an additive in an amount of about 1% to about 5% by weight of the mixture.

Pellicle including a water-soluble adhesive and photomask assembly including the pellicle

A photomask and a method of forming the same, the photomask including a transparent substrate; a light shielding pattern on the transparent substrate, the light shielding pattern including molybdenum and silicon; and an etch stop layer covering at least a sidewall of the light shielding pattern, wherein the etch stop layer has an etch rate lower than an etch rate of the light shielding pattern with respect to an ammonia-based cleaning solution.

Method of forming photomask

Provided is a mask. The mask may include a mask substrate, mask patterns on the mask substrate, frames disposed on an edge of the mask substrate outside the mask patterns, and a pellicle spaced apart from the mask patterns, the pellicle being disposed on the frames, wherein the pellicle includes protection layers each of which has a nanometer thickness.

Mask including pellicle, pellicle repairing apparatus, and substrate manufacturing equipment

Provided is a method of manufacturing a pellicle. The method includes preparing a substrate, forming a membrane on the substrate by performing a chemical vapor deposition (CVD) process, separating the membrane from the substrate in a first solvent, rinsing the separated membrane in a second solvent, and transferring the separated membrane to a frame in a third solvent.

Methods of manufacturing pellicles having graphite layers

Photomask and method of forming the same

Growing community of inventors

Seoul, South Korea

Jaehyuck Choi