Samsung Electronics Co., Ltd.

Jaehong Park

Yusuf Cinar

Hanhong Lee

Seongyun Baek

Je-Woo Han

Junho Yoon

Gyungjin Min

Yongmoon Jang

Dongchan Kim

Doil Kong

Bumjun Kim

Sungchul Hur

Jaeheon Ma

Youngseok Hong

Sanghoon Lee

Dohyung Kim

Seunghoon Lee

Jinyoung Park

Dong-chan Lim

Youngduk Kim

Kyohyeok Kim

Sang-Youn Lee

Joonwon Chang

Kyoungmook Lim

Kyungyub Jeon

Sungyeon Kim

Seungwan Yoo

Jeongyeon Lee

Youngduck Kim

Kyungheon Noh

Sehwoong Jeong

Sungjae Lim

Woowon Park

An electronic device including an application processor and a communication processor. The communication processor, for managing a resource memory, configured to monitor an occupancy rate of the resource memory for detecting a memory leakage, release a network connection when the electronic device is in an idle state, in response to the detecting of the memory leakage, initialize the resource memory after the network connection is released, and reconnect the network connection, wherein the idle state indicates a state when the electronic device is not occupied or used by a user, and wherein the initialization is performed at a non-flag area from among the resource memory.

Electronic device for securing usable dynamic memory and operating method thereof

The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.

Portable solid-state drive module

An ion beam source including a plasma chamber including a plasma generating space, a plasma generator configured to generate plasma in the plasma generating space, a first grid connected to the plasma chamber, a second grid connected to the plasma chamber, and a first grid driver connected to the first grid. The first grid driver may be configured to move the first grid relative to the second grid.

Ion beam source, substrate process apparatus including the same, and method of processing a substrate using the same

An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.

Light emitting device modules

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

Solid state drive apparatus and data storage apparatus including the same

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

Electronic device and method of manufacturing an electronic device

Various embodiments of the present invention pertain to a method for pairing devices using near field communication and an electronic apparatus using the same. The electronic apparatus comprises: a first wireless communication module supporting first wireless communication; a second wireless communication module supporting second wireless communication; a memory; and a processor operatively connected to the first wireless communication module, the second wireless communication module and the memory, wherein the processor is set to: detect a tag of an external electronic apparatus via the first wireless communication module; transmit a first command for driving a designated application of the external electronic apparatus to the external electronic apparatus via the first wireless communication module; receive, via the first wireless communication module, Bluetooth address information of the external electronic apparatus corresponding to the driving of the designated application; and perform, via the second wireless communication module, pairing with the external electronic apparatus on the basis of the received Bluetooth address information, wherein the pairing is performed in a tagging manner instead of a scanning manner during the pairing of the electronic apparatus with the external electronic apparatus, to thereby intuitively select the external electronic apparatus to be paired and simply perform a pairing process. Various other embodiments are possible.

Method for pairing devices using near field communication and electronic apparatus using same

An electronic device including an application processor and a communication processor. The communication processor including a resource memory, the communication processor configured to monitor an occupancy rate of the resource memory, determine whether the electronic device is in an idle state, forcibly release a network connection, clear the resource memory, and reconnect the network connection.

Disclosed in various embodiments of the present document are: a structure including a nonmetallic material and guiding, in one direction, light incident on one side; and an electronic device including the structure in an inner space thereof. According to the various embodiments, provided is an electronic device comprising: a housing having an inner space, and including an outer surface facing a first direction, an inner space facing the direction opposite to the first direction, and a display unit which is formed between the outer surface and the inner space and which has a thickness through which light passes through; a printed circuit board arranged in the inner space; at least one light-emitting element arranged in the inner space; and a nonmetallic structure arranged in the inner space, wherein the nonmetallic structure includes: a first part having a light guide between the light-emitting element and the display unit and including a transparent or translucent first material; a second part which is integrally formed with the first part, includes the first material, and is directly or indirectly fixed to the printed circuit board or the housing; and a third part encompassing at least a portion of the light guide and including a translucent second material. The nonmetallic light guide structure and the electronic device including same can be varied according to embodiments.

Electronic device including nonmetallic light guide structure

A method of fabricating a semiconductor device is disclosed. The method may include forming an target layer on a substrate, forming a mask pattern on a target layer, performing a first process to etch the target layer and form a first sub-trench, and performing a second process to further etch the target layer and form a second sub-trench. First and second sidewall patterns may be formed on a sidewall of the mask pattern to be used as an etch mask in the first and second processes, respectively. Outer sidewalls of the first and second sidewall patterns may be formed to have different angles with respect to a top surface of the substrate.

Method of forming fine pattern of semiconductor device

Semiconductor devices are provided. Each of the semiconductor devices may include a plurality of electrodes. Moreover, each of the semiconductor devices may include a supporting pattern connected to sidewalls of the plurality of electrodes. Related methods of forming semiconductor devices are also provided. For example, the methods may include forming the supporting pattern before forming the plurality of electrodes.

Semiconductor devices including a support for an electrode and methods of forming semiconductor devices including a support for an electrode

Growing community of inventors

Suwon-si, South Korea

Jaehong Park