Samsung Electronics Co., Ltd.

Jaeheung Ye

Jungje Bang

Haejin Lee

Chi-Hyun Cho

Kyungha Koo

Se-Young Jang

Chunghyo Jung

Seyoung Jang

Jaedeok Lim

Min Jae Park

Yongwon Lee

Min Sang Park

Gyeongmin Jin

Kyuhwan Lee

Yeonkyung Chung

An electronic device includes a printed circuit board ('PCB') structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

Electronic device including printed circuit board structure including thermal interface material

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Electronic device having heat collection/diffusion structure

The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.

Electronic device comprising display module having stress neutralization layer between flexible substrate and conductive layer

Growing community of inventors

Gyeonggi-do, South Korea

Jaeheung Ye