Samsung Electronics Co., Ltd.

Jaehee Lee

Sunyoung Lee

Sungho Kang

Han Ki Lee

Ilyoung Han

Geunkyu Choi

Nohsung Kwak

Jonghwi Seo

Guesuk Lee

Euijin Seo

A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam

A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.

Plasma treating apparatus, substrate treating method, and method of manufacturing a semiconductor device

Growing community of inventors

Daegu, South Korea

Jaehee Lee