Samsung Electronics Co., Ltd.

Jaegon Ghim

Yunbum Lee

Jeongho Kang

Youngmin Lee

Seongbeom Hong

Namwoo Kim

Kyungwan Park

Jongpil Lee

Chanyoul Park

JeongHo Kang

Haimin Lee

The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

Apparatus for connecting modules included in electronic device

An electronic device according to various embodiments of the present disclosure can comprise: a housing including a first plate, a second plate oriented in the direction opposite to that of the first plate, and a side member surrounding the space between the first plate and the second plate; a plurality of insulating layers interposed between the first plate and the second plate; a printed circuit board in parallel to the second plate; an array of first conductive plates mounted on one layer of the printed circuit board; a second conductive plate mounted on one layer of the printed circuit board so as not to overlap the array when viewing from the top of the second plate; a wireless communication circuit electrically connected to the array and set to provide wireless communication at a frequency of 20-100 GHz; and a grip sensing circuit electrically connected to the second conductive plate. Other various embodiments can be possible.

Electronic device comprising communication device including sensing electrode

A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.

Front end module supporting device to device communication using plural frequency bands and electronic device including the same

Growing community of inventors

Suwon-si, South Korea

Jaegon Ghim