Samsung Electronics Co., Ltd.

Jaecheol Kim

Dongwoo Kim

Jinkyu Kim

Jeongho Kim

Wooyoung Choi

Seungyoung Lee

Yongdae Ha

Mangun Hur

Hyeokseon Yu

Heetae Oh

Jaewoong Han

Jaesoo Chaung

Gilman Kang

Jongshik Ha

A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.

Bonding head and a bonding apparatus having the same

An electronic device includes a system-on-chip (SoC) including at least one component, a memory, and a processor functionally connected to the SoC and the memory. The processor is configured to apply a default voltage for driving the at least one component at a specific frequency. The processor is also configured to determine whether data on an offset voltage corresponding to the at least one component and the specific frequency is stored. The processor is further configured to apply the offset voltage, being different from the default voltage, to the at least one component when the data on the offset voltage is stored. Other embodiments are possible.

Apparatus and method for applying suitable voltage to a component of a system-on-chip

Growing community of inventors

Daegu, South Korea

Jaecheol Kim