Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Colorzip Media, Inc.

Intellectual Discovery Co., Ltd.

Amogreentech Co., Ltd.

Postech Research and Business Development Foundation

Uberple Co., Ltd.

Jae Yun Kim

Gi Tae Lim

Dong Joo Park

Gyu Wan Han

Keun Soo Kim

Dae Byoung Kang

Chel Woo Park

Dong Soo Ryu

Byoung Jun Ahn

Ji Young Chung

Tack Don Han

Cheol Ho Cheong

Min Hwa Chang

Seong Hun Jeong

Myung Jea Choi

Jong Young Kim

Eui Jae Kim

Han Yeong Choi

Jin Seong Kim

Won Bae Bang

Ju Hoon Yoon

Jin Young Khim

Do Hyun Na

Shaun Bowers

Se Hwan Hong

Byong Woo Cho

Woon Kab Jung

Byoung Woo Cho

Seul Bee Lee

Seung Jae Yu

Ju Hyung Lee

Kyung Rok Park

Myung Jae Choi

SAng Hyeon Kang

Jong Sik Paek

Byong Jin Kim

Jin Han Kim

In Ho Kim

Ju Young Lee

Yoon Joo Kim

Dong-Woo Cho

Tae Kyung Hwang

Kyung Gu Han

Kyeong Sool Seong

Seok Ho Na

Jae Beum Shim

Mi Kyoung Choi

Sang Goo Kang

Jae Yeon Lee

Kyoung Rock Kim

Jaepil Jeong

In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Semiconductor package and fabricating method thereof

A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Semiconductor devices and related methods

In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

The method for decellularization of kidney tissue according to the present invention, the decellularized material produced through the method, and a bioink comprising the decellularized material have the effect of maximizing the effect of kidney treatment by maximizing the content of components specialized for kidney treatment such as the collecting duct and renal tubule of the kidney.

Method of decellularization of kidney tissues, decellularized material by the method and bioink comprising the decellularized material

A flat-plate filter for water treatment and a flat-plate filter module comprising the same are provided. The flat-plate filter for water treatment according to an embodiment of the present invention comprises: a piece-shaped filtration member comprising a first support and a membrane formed on both sides of the first support; and a support frame fitted in and coupled to the edge of the filtration member so as to support the filtration member, and having a flow path through which filtered water introduced from at least one surface of the filtration member flows, wherein a part of the filtration member is disposed in the flow path or at the edge of the flow path such that the first support is exposed.

Flat-plate filter for water treatment and flat-plate filter module comprising same

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Methods and systems for extracting sentences are provided, one of methods comprises, receiving a keyword, parsing a document, and identifying each of a plurality of sentences included in the parsed document, configuring a graph having vertices and edges, wherein each vertex corresponds to each sentence, and each edge has a first weight corresponding to similarity between each pair of the sentences, calculating importance of each sentence by applying a modified PageRank algorithm to the graph, wherein the modified PageRank algorithm is designed to reflect a second weight corresponding to whether the keyword is included in a sentence of each vertex adjacent to a first vertex and extracting important sentences from the document based on the calculated importance.

Method and system for extracting sentences

Growing community of inventors

Incheon, South Korea

Jae Yun Kim