Samsung Electronics Co., Ltd.

Jae-young Hong

Dong-Kuk Kim

Chang-Cheol Lee

Min-Ill Kim

Tae-Hoe Hwang

Hyuk-jin Lee

Kyu-deuk Kim

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

Semiconductor package module

A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion. The flexible film includes an insulating film; a plurality of first terminals extending through the insulating film, the first terminals contacting external connection terminals of the external connection terminal portion; a plurality of second terminals extending through the insulating film and spaced a predetermined distance apart from the first terminals, the second terminals contacting the bonding pads; and conductive line patterns formed on a top surface of the insulating film, the conductive line patterns electrically connecting the first terminals to the second terminals that respectively correspond to the first terminals.

Semiconductor package using flexible film and method of manufacturing the same

The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Growing community of inventors

Chungcheongnam-do, South Korea

Jae-young Hong