Mk Electron Co., Ltd.

Jae Yeol Son

Hui Jung Kim

Jeong Tak Moon

Seul Gee Lee

Young Woo Lee

Jae Hun Song

Santosh Kumar

Eung Jae Kim

Ho Gun Cha

Min Su Park

Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Semiconductor package using core material for reverse reflow

A solder ball and a semiconductor device using the same are provided. In a Sn-based solder ball in which a first plating layer and a second plating layer are sequentially formed on a core ball, the second plating layer includes a Sn&#x2014;Ag&#x2014;Cu alloy, and AgSn intermetallic compound (IMC) nanoparticles or Ag&#x2014;Sn compound nanoparticles exist in the second plating layer. The solder balls have high sphericity and stand-off characteristics and connection reliability so that a semiconductor device having a high degree of integration may be implemented.

Solder balls and semiconductor device employing the same

Growing community of inventors

Gyeonggi-do, South Korea

Jae Yeol Son