Samsung Sdi Co., Inc.

Cheil Industries Inc.

Jae-Yeol Baek

Sang-Soo Kim

Jong-Hwa Lee

Ji-Yun Kwon

Eun-Ha Hwang

Bum-Jin Lee

Kun-Bae Noh

Eun-Bi Park

Sang-Haeng Lee

Min-Soo Kim

Young-Min Kim

Sung-Min Kim

Sung-Hwan Kim

Jin-Hee Kang

Hyun-Ji Song

Yun-Jun Kim

Chung-Heon Lee

Yong-Woon Yoon

Hea-Jung Kim

Seung-Hee Hong

Youn-Hee Nam

Jin-Young Lee

Dae-Yun Kim

Seulgi Jeong

Songse Yi

Sang-Kyeon Kim

Byeri Yoon

Sun-Hae Kang

Jae-Hwan Song

Chung-Beum Hong

Yeon-Hee Jo

In-Chul Hwang

Naery Yu

Yong-Tae Kim

Eun-Kyoung Youn

Sun-Min Hwang

Won-Jong Hwang

MyeongKoo Kim

A method of producing a layer structure includes forming a first organic layer by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer through a curing process.

Method of producing layer structure, layer structure, and method of forming patterns

Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same

Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160&#xb0; C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160&#xb0; C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

Growing community of inventors

Suwon-si, South Korea

Jae-Yeol Baek