Samsung Electronics Co., Ltd.

Jae-Woo Jeong

Junghoon Kim

Min-Young Park

Jinyoung Choi

Se-Young Jang

Heeyoub Kang

Dongok Kwak

Kun-Tak Kim

Won-hwa Lee

Joonyoung Oh

Jaebum Byun

Soon-Wan Chung

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.

Semiconductor module

A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Fixing device for shield can

Growing community of inventors

Seoul, South Korea

Jae-Woo Jeong