Dongjin Semichem Co., Ltd.

Jae-Won Yoo

Kyung-Min Park

Dong-Jin Nam

Byung-uk Kim

Seung-Sock Choi

Doo-Shik Kim

Seong-Yeon Oh

Doo-shick Kim

Un-yong Kim

Eun-jin Kwak

Joon-Yeon Cho

Kyong-Il Kwon

Soo-Jung Park

The present invention relates to a coating composition comprising a bis-type silane compound, and particularly relates to a coating composition which has high storage stability and can form a highly transparent and high-strength coating film, a preparation method thereof and a coating film formed using the same.

Coating composition comprising bis-type silane compound

The present invention relates to a photo-curable organic-inorganic hybrid composition, more particularly to a photo-curable organic-inorganic hybrid resin composition having superior physical properties such as UV resistance, chemical resistance, light transmittance, adhesive property, insulating property, heat resistance, flatness and water resistance and in particular, having excellent heat resistance and adhesive property enabling the composition to endure a thermal deformation caused by a processing temperature change during post-process after a film is cured. Thus, the composition of the invention is suitable for use as an insulating material and an encapsulating material for a protective film of optical devices including display devices and semiconductors.

Photo-curable organic-inorganic hybrid resin composition

There are provided a fluorine-containing photocurable resin composition and a method of preparing a mold comprising the same and more particularly, a photocurable resin composition having chemical resistance, mechanical properties and high transmittance, etc. as well as being easily wetted with and released from thermosetting or photocurable resins for pattern formation regardless of additional surface treatment, as opposed to the existing polymer resin materials used for resin molds, and a method of preparing a resin mold using the same.

Photocurable resin composition containing fluorine and method for producing a resin mold using same

The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.

Photosensitive resin composition for photoresist

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Hwaseong, South Korea

Jae-Won Yoo