Cheil Industries Inc.

Jae Won Choi

Baek Soung Park

In Hwan Kim

Sung Min Kim

Gyu Seok Song

Jun Woo Lee

Su Mi Lim

Ji Ho Kim

Hye Jin Kim

Su Ml Im

Jin Man Kim

An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120&#xb0; C. to 130&#xb0; C. for 1 to 20 minutes, a second stage at a temperature ranging from 140&#xb0; C. to 150&#xb0; C. for 1 to 10 minutes, a third stage at a temperature ranging from 160&#xb0; C. to 180&#xb0; C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160&#xb0; C. to 180&#xb0; C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

Adhesive composition for semiconductor and adhesive film including the same

A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

Dicing die-bonding film and method of forming a cut on the dicing die-bonding film

A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mmor greater.

Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device

An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170&#xb0; C. after 80% or more curing to a storage modulus at 40&#xb0; C. before curing in the range of about 1.5 to about 3.0.

Adhesive film and electronic device including the same

Growing community of inventors

Uiwang-si, South Korea

Jae Won Choi