Samsung Electronics Co., Ltd.

Jae Sung You

Jong Sup Song

Min Jung Kim

Tae Gyu Kim

Ho Sun Paek

Hak Hwan Kim

Ho Young Song

Cheol Jun Yoo

Kyung Mi Moon

Ill Heoung Choi

Young Hee Song

Won Hoe Koo

Jae Chul Kim

Jun Bum Lee

Yun Tae Hwang

A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

LED module and LED lamp including the same

A white LED module includes a circuit board, at least one first LED light source on the circuit board and emitting a first white light having a first color temperature, at least one second LED light source on the circuit board and emitting a second white light having a second color temperature, higher than the first color temperature, a wiring structure in the circuit board to selectively drive the at least one first LED light source and the at least one second LED light source, and a transparent encapsulant on the circuit board, to cover the at least one first LED light source and the at least one second LED light source. The transparent encapsulant includes a transparent resin and a light-scattering powder in the transparent resin.

White light emitting diode module and lighting apparatus

A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof

A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.

Light emitting device

There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.

Method of manufacturing light emitting device

There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.

Vacuum tray and method of manufacturing light emitting device using the same

A light emitting diode (LED) module includes a substrate, an LED disposed on the substrate, a phosphor layer disposed on the LED, and a lens disposed on the substrate. The substrate has a recess defined therein. The lens is fastened to the substrate through the recess. A manufacturing method for the LED includes forming the recess in the substrate, mounting the LED on the substrate, forming the phosphor layer on the LED, and forming the lens directly on the substrate such that the lens is fastened to the substrate through the recess.

Light emitting diode module and method for manufacturing the same

There is provided a light emitting device package including: a substrate having a cavity formed therein; a heat sink provided on a bottom surface of the cavity to be adjacent to an inner wall of the cavity; a light emitting device mounted on the heat sink; and a phosphor layer provided within the cavity and covering the heat sink and the light emitting device.

Light emitting device package and manufacturing method thereof

There is provided a light emitting device package, including at least one light emitting device; a lead frame electrically connected to the light emitting device; a body part supporting the light emitting device and the lead frame and including a cavity opened so as to expose the light emitting device and the lead frame; a reflecting part fitted and fixed into the cavity so as to surround the light emitting device; and a sealing part filled in the reflecting part and sealing the light emitting device.

Light emitting device package

A camera flash module is provided. The camera flash module may include a lens having a single refractive surface and a reflector that adjusts a direction of a light emitted from the lens. Accordingly, maintaining of a distance between a light emitting device and the lens may not be needed and thus, the camera flash module may be readily manufactured and a productivity may be improved. An error rate caused by distortion in a tilt and an optical axis between the light emitting device and the lens may be reduced. The reflector may adjust a direction of a light emitted from the lens and thus, an emission pattern requested by a camera may be satisfied, and a velocity of light may be improved. The reflector may surround the lens and thus, may prevent the lens from being detached from a light emitting device package body when an external impact occurs.

Growing community of inventors

Gyeonggi-do, South Korea

Jae Sung You