Hana Micron Inc.

Jae-Sung Lim

Ju-Hyung Kim

Jin-Wook Jeong

Hyouk Lee

Hyun-Joo Kim

Hyung-Jun Kim

A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case. The wiring structure may include a material capable of being bent or folded, and also may include a connection wiring disposed on an inner surface of the upper flexible case for electrically connecting the flexible integrated circuit device package with an external device, a connection pin disposed on an outer surface of the upper flexible case, and a via wiring passing through the upper flexible case. The anisotropic conductive film may be disposed between the flexible integrated circuit device package and the upper flexible case for electrically connecting the connection pad with the connection wiring.

Memory card systems comprising flexible integrated circuit element packages, and methods for manufacturing said memory card systems

An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

Integrated circuit device packages and methods for manufacturing integrated circuit device packages

Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.

Electronic devices and methods of manufacturing electronic devices

An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.

Growing community of inventors

Cheonan-si, South Korea

Jae-Sung Lim