Cheil Industries Inc.

Samsung Sdi Co., Inc.

Jae Sun Han

Dong Seon Uh

Kwang Jin Jung

Kyoung Soo Park

Ja Young Hwang

Hyun Hee Namkung

Hyun Wook Kim

Jin Young Seo

Kyoung Ku Kang

Ji Yeon Kim

Young Ju Shin

Kyoung Hun Shin

Young Woo Park

Kyung Il Sul

Byeong Geun Son

Ji Eun Kim

Kil Sung Lee

Young Hoon Kim

Arum Yu

Jung Sik Choi

Jong Hyuk Eun

Tae Hyun Lee

Jin Seong Park

Hyun Min Choi

Hyoun Young Kim

Soon Young Kwon

Joon Mo Seo

Nam Ju Kim

Jeong Ku Kang

Kil Yong Lee

Gyu Ho Lee

Sung Hak Choi

Jeong Min Hong

Provided are an optical member and an optical display device including same, the optical member comprising: a base film; and a light transmission control layer stacked on the lower surface of the base film, wherein the light transmission control layer comprises: a dye or dye mixture including at least one of a first dye having a maximum absorption wavelength of about 540 nm to about 630 nm, a second dye having a maximum absorption wavelength of about 390 nm to about 470 nm, a third dye having a maximum absorption wavelength of about 480 nm to about 530 nm, and a fourth dye having a maximum absorption wavelength of about 640 nm to about 760 nm; and a resin having a hydroxyl value of 5 mgKOH/g or less.

Optical member and optical display device comprising same

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60&#xb0; C. to 85&#xb0; C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below,Elastic modulus change(%)={()/}&#xd7;100&#x2003;&#x2003;[Equation 1] wherein Mis an initial elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C., and Mis a elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C. after the film is left at 25&#xb0; C. for 170 hours.

Semiconductor device connected by anisotropic conductive film

A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80&#xb0; C. to about 110&#xb0; C. and a second epoxy resin having an exothermic peak temperature of 120&#xb0; C. to 200&#xb0; C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/&#xb0; C. or less at about 100&#xb0; C. or less.

Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1:Connection resistance increment (%)=|()/|&#xd7;100&#x2003;&#x2003;(Expression 1)where A is a connection resistance measured after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85&#xb0; C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.

An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0&#xd7;10/dto 10.0&#xd7;10/d(particles) per square millimeter (mm) (where d is a diameter of the conductive particles in &#x3bc;m).

Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same

An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, Rmay be selected from the group of hydrogen, C-Calkyl, C-Caryl, &#x2014;C(&#x2550;O)R, &#x2014;C(&#x2550;O)OR, and &#x2014;C(&#x2550;O)NHR(in which R, R, and Rmay each independently be selected from C-Calkyl and C-Caryl), Rmay be C-Calkyl, and Rmay be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C-Calkyl-substituted benzyl group, and a naphthylmethyl group.

Electronic device using anisotropic conductive composition and film

An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.

Optical member comprising anisotropic conductive film

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.

Anisotropic conductive film and semiconductor device

A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.

Method of manufacturing semiconductor device including thermal compression

An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.

Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods

A photosensitive resin composition for forming column spacers for a liquid crystal display device is provided. The composition includes an alkali-soluble resin, a reactive unsaturated compound, a photoinitiator and a solvent. The alkali-soluble resin includes structural units represented by Formulae 1, 2 and 3, which are described in the specification. A pattern formed using the composition is also provided. The pattern shows improved thickness uniformity, good developability without leaving any residual image, superior solvent resistance and high recovery rate.

Photosensitive resin composition for column spacers for liquid crystal display device, column spacers formed using the composition and display device comprising the column spacers

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Uiwang-si, South Korea

Jae Sun Han