Samsung Electro-Mechanics Co., Ltd.

Jae Sub Cho

Jung Jin Kim

Jin Mun Ryu

Bo Kyoung Kim

Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

Camera module and method of manufacturing the same

A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.

Growing community of inventors

Gyeonggi-do, South Korea

Jae Sub Cho