Jettech Ltd.

Jae Song Chung

A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder belt including a belt body, the separation, fatigue, and the sliding of the finger during feeding of the strip-shaped parts is resolved. Since external force can be applied in the horizontal direction when loading and unloading the strip-shaped parts, peripheral devices are simplified.

Feeder belt for strip-shaped parts

A fan jet nozzle for use with an ultra high pressure liquid-phase cleaning media for use in a deflashing apparatus includes a nozzle tip, which is made of a super hard material such as diamond, and is secured inside a nozzle holder through sintering. Upper and lower nozzle bores above and beneath the nozzle tip are processed to converge and communicate with each other inside the nozzle tip, resulting in a center nozzle hole having an elliptical shape. One of the upper and lower nozzle bores is processed into a circular cone shape, and the other one of the upper and lower nozzle bores is processed to have an arched longitudinal sectional shape and a cross sectional shape wherein its width increases toward a center thereof and decreases toward both sides thereof.

Fan jet nozzle for use with ultra high pressure liquid phase cleaning media for use in deflashing apparatus

Disclosed herein is a deflash technique for removing flash from a portion of a semiconductor package to be plated before a plating process and after a sealing process accompanied by resin molding during the manufacture of semiconductors, and more particularly a semiconductor package having grooves formed at side flash, a groove forming method, and a deflshing method using the semiconductor package, for removing the side flash formed at a side portion of a lead frame where it is difficult to perform a deflashing process. Conventionally, it is impossible to completely remove side flash remaining on the lead frame at a region where it is difficult to perform a deflashing process even by injecting water jet or media at a very high pressure, or by irradiating laser beams thereto while changing irradiation directions. However, according to the present invention, by virtue of the grooves formed at the side flash by laser irradiation, it is possible to easily remove the side flash and to improve deflashing efficiency and quality of products.

Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using semiconductor package formed with grooves

Growing community of inventors

Inchun-shi, South Korea

Jae Song Chung