Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Jae-Sang Baik

Yong-jin Kim

Young-ho Lee

Jung-Hyeon Kim

Do-hyung Kim

Hyo-Jae Bang

Hyun-Seok Choi

Yong-Hyun Kim

Kyoung-Sun Kim

Jung-Chan Cho

Yang-Je Lee

A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Stacked semiconductor module, method of fabricating the same, and electronic system using the same

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Suwon-si, South Korea

Jae-Sang Baik