Samsung Electronics Co., Ltd.

Jae Min Jung

Chang Hyun Lee

Jang Beom Yang

Hee Jae Jo

Se Hoon Lim

Yong Hyun Lim

Jun Ho Koh

Hae In Chun

A chip-on-film includes an insulating film including a bonding region for bonding to an external device, a plurality of interconnections disposed on the insulating film and partially extending into the bonding region, and an integrated circuit (IC) chip disposed on the insulating film so as to be electrically connected to the plurality of interconnections. The chip-on-film further includes a solder resist disposed so as to cover the insulating film excluding the bonding region and so as to cover the plurality of interconnections excluding portions extending into the bonding region, and a stepped portion located between the bonding region and the solder resist. The stepped portion forms a boundary against a flow of the solder resist into the bonding region.

Chip-on-film and method of manufacturing the same

Headset for measuring brain waves

Growing community of inventors

Seoul, South Korea

Jae Min Jung