Samsung Electronics Co., Ltd.

Jae Min Ahn

Young Ky Kim

Hi Chan Moon

Soon Young Yoon

Jin Woo Choi

Byung Yul So

Hyun Suk Lee

Jae-Hyuk Yang

Seung Min Koo

Hee-Won Kang

Young Sun Kim

Jin Soo Park

Jong Seon No

Jae Yoel Kim

Hee Won Kang

Young Jun Hwang

Kyeong Cheol Yang

Ha Bong Chung

Joong Ho Jeong

Su Won Park

Jae Heung Yeom

An air conditioner including a drain hose to be injection-molded is disclosed. An air conditioner includes a main body of an indoor unit, a heat exchanger disposed in the main body of the indoor unit, and a drain hose configured to discharge condensed water generated from the heat exchanger, wherein the drain hose is disposed in the main body and is injection-molded.

Drain hose and air conditioner including the same

The present invention relates to a semiconductor package which is suitable for attachment and wire-bonding of a large chip so that the high-performance and high-density tendency of semiconductor devices can be accomplished. According to the present invention, by connecting the electrodes of a chip to leads with electrical connection leads, even a large chip can be loaded without a pad. Also, since the bonding parts and lead-connection parts of the connection leads can be formed arbitrarily at any portion close to the electrodes of the chip, the chip is manufactured simply and the efficiency of the wire-bonding is improved due to the short wire-bonding length so that the reliability of products is efficiently improved.

Semiconductor package

Growing community of inventors

Gwangju, South Korea

Jae Min Ahn