Samsung Electronics Co., Ltd.

Jae-Kyu Lee

Jae-Goo Lee

Dae-Won Kim

Ki-seok Suh

Sang-Hyeon Lee

Ki-Nam Kim

Eun-Jung Kim

Hyun-Ju Lee

Byoung-Hee Lee

Yong-Jun Kim

Won-Suk Yang

Seung-Pil Ko

Jai-Hoon Sim

Suk-Chan Hong

Han-Awl Lee

Woong-Hae Choi

Jun-Chul Kang

A resistive memory device includes a memory cell array having a plurality of memory cells therein, which operate in response to word line driving and column selecting signals. Each of memory cells includes a resistive device and a cell transistor connected in series. An I/O sense amplifier senses and amplifies data output from the memory cell array to thereby generate output data, and also generate program current based on input data and provide the program current to the memory cell array. The resistive memory device is also configured to read output data from the I/O sense amplifier and adjust interface states of the cell transistors based on a voltage level of the output data during a test mode.

Resistive memory device capable of increasing sensing margin by controlling interface states of cell transistors

A resistive memory device includes a cell block having a plurality of unit memory cells in which a resistive element and a cell select element are connected to each other in series, the cell block operating in response to a word line, a bit line, and a source line, and a dummy line, when different interconnection layers form the source line and the bit line, respectively, connected to one of the interconnection layers which is formed at a lower side the remaining interconnection layer between the interconnection layers for the source line and the bit line, wherein the dummy line has a resistance lower than a resistance of the lower interconnection layer.

Resistive memory device capable of improving sensing margin of data

The magnetic memory device includes a plurality of source lines arranged in parallel in a second direction orthogonal to a first direction while extending in the first direction on a substrate, a plurality of word lines arranged in parallel in the first direction while extending in the second direction on the substrate, a plurality of bit lines arranged in parallel in the second direction while extending in the first direction on the substrate to alternate with the plurality of source lines, and a plurality of active regions arranged to extend at an oblique angle with respect to the first direction and arranged so that one memory cell is selected when one of the plurality of word lines and one of the plurality of source lines or the plurality of bit lines are selected.

Magnetic memory device

Memory systems can include a memory device having an array of nonvolatile memory cells therein, which is electrically coupled to a plurality of bit lines and a plurality of word lines. The nonvolatile memory cells may include respective nonvolatile resistive devices electrically coupled in series with corresponding cell transistors. A controller is also provided, which may be coupled to the memory device. The controller can be configured to drive the memory device with signals that support dual programming of: (i) the nonvolatile resistive devices; and (ii) interface states within the cell transistors, during operations to write data into the memory device.

A resistive memory device includes a memory cell array, an input/output (I/O) sense amplifier unit, an address input buffer, a row decoder, and a column decoder. The memory cell array includes unit memory cells, and operates in response to a word line driving signal and a column selecting signal, each unit memory cell includes a resistive device and a compensation resistive device. The I/O sense amplifier unit amplifies data output from the memory cell array to generate first data, and transfers input data to the memory cell array. The address input buffer generates a row address signal and a column address signal based on an external address. The row decoder decodes the row address signal and generates the word line driving signal based on the decoded row address signal. The column decoder decodes the column address signal and generates the column selecting signal based on the decoded column address signal.

Resistive memory device including compensation resistive device and method of compensating resistance distribution

A semiconductor device includes a first semiconductor layer extending in a first direction on a substrate, a plurality of second semiconductor layers spaced apart in the first direction on the first semiconductor layer, and an insulation layer structure surrounding side walls of the first semiconductor layer and the plurality of second semiconductor layers. The first semiconductor layer may have a first conductivity type, and the plurality of second semiconductor layers may have a second conductivity type.

Semiconductor device including a diode and method of manufacturing the same

An apparatus and a method for automated testing of electrostatic discharge of a Device Under Test (DUT) are provided. In the apparatus and the method, an electrostatic pulse is applied to the DUT, a malfunction type is detected from the DUT, and a control command is transmitted to the DUT to return a test mode of the DUT to a normal mode according to the detected malfunction type.

Apparatus and method for automated testing of device under test

A resistive memory device may include a substrate, gate electrode structures, a first impurity region, a second impurity region, a first metal silicide pattern and a second metal silicide pattern. The substrate may have a first region where isolation patterns and first active patterns may be alternately arranged in a first direction, and a second region where linear second active patterns may be extended in the first direction. The gate electrode structures may be arranged between the first region and the second region of the substrate. The first and second impurity regions may be formed in the first and second impurity regions. The first metal silicide pattern may have an isolated shape configured to make contact with an upper surface of the first impurity region. The second metal silicide pattern may make contact with an upper surface of the second impurity region.

Protruding post resistive memory devices

A mobile phone includes a multi-band antenna which is mutually connected in a dependent manner for operation according to a signal transmitted to and received from the mobile phone; and a resonance unit for generating resonance for multiple frequency bands as ends of the multi-band antenna are spaced apart at a predetermined interval, to improve mute performance, reduce SAR, and prevent a reduction in call performance due to an influence of a user's body and hand when holding the mobile phone to make a call.

Multi-band antenna for mobile phone

Methods of forming a MOS transistor and a MOS transistor fabricated thereby are provided. The MOS transistor includes a semiconductor substrate of a first conductivity type, and an insulated gate pattern having sidewalls disposed on a predetermined region of the semiconductor substrate of a first conductivity type so that portions of the semiconductor substrate of a first conductivity type on at least one side of the insulated gate pattern remain uncovered by the insulated gate pattern. The MOS transistor also includes impurity regions having at least an upper surface of a second conductivity type disposed on the semiconductor substrate at at least one side of the insulated gate pattern, as well as at least one spacer disposed on at least one sidewall of the insulated gate pattern. The MOS transistor further contains a pad of a second conductivity type disposed on an upper surface of the impurity regions, whereby the pad covers a lower portion of the at least one spacer.

MOS transistor in a semiconductor device

In a MOS transistor and a method of manufacturing the same, a gate structure including a gate insulating layer and a gate electrode is formed on a semiconductor substrate. A first insulating layer is formed to cover the gate structure. A second insulating layer is formed on the substrate that is spaced apart from the first insulating layer. A lightly doped source/drain region is formed in the surface portions of the substrate between the second insulating layer and the gate structure. A source/drain extension layer are formed on the lightly doped source/drain region. A heavily doped source/drain region is formed on the second insulating layer so as to connect with the source/drain extension layer. The short channel effect is suppressed and the source/drain junction capacitance is reduced.

Semiconductor device with source/drain extension layer

Methods of fabricating integrated circuit devices include forming a trench in a face of an integrated circuit substrate. The trench has a trench sidewall and a trench floor. The method further including forming a first insulating layer on the trench sidewall that exposes at least part of the trench floor and forming a conductive plug in the trench on the trench floor. The conductive plug is electrically connected to the substrate at the trench floor through the trench sidewall that exposes the at least part of the trench floor. The conductive plug also has a plug top opposite the trench floor that is recessed beneath the face of the substrate. The method further includes forming a second insulating layer on the plug top.

Methods of fabricating integrated circuit devices having trench isolation structures

A method for forming a shallow well of a semiconductor device using low-energy ion implantation is described. A well region is formed to the depth of a trench isolation layer using a low-energy, high-dose ion implantation process. The method for forming a well using low-energy ion implantation can minimize well margin reduction caused by impurity spread and well margin reduction caused by shrinkage of a thick photoresist pattern.

Method for forming shallow well of semiconductor device using low-energy ion implantation

Method of forming a MOS transistor in a semiconductor device and a MOS transistor fabricated thereby

Integrated circuit devices include an integrated circuit substrate having a face and a trench in the face. The trench has a trench sidewall and a trench floor. A first insulating layer is provided on the trench sidewall that exposes at least part of the trench floor and a conductive plug is provided in the trench on the trench floor. The conductive plug is electrically connected to the substrate at the trench floor through the trench sidewall that exposes the at least part of the trench floor. The conductive plug also has a plug top opposite the trench floor that is recessed beneath the face of the substrate. A second insulating layer is provided on the plug top. Methods of fabricating integrated circuit devices include forming a trench in a face of an integrated circuit substrate. The trench has a trench sidewall and a trench floor. The method further including forming a first insulating layer on the trench sidewall that exposes at least part of the trench floor and forming a conductive plug in the trench on the trench floor. The conductive plug is electrically connected to the substrate at the trench floor through the trench sidewall that exposes the at least part of the trench floor. The conductive plug also has a plug top opposite the trench floor that is recessed beneath the face of the substrate. The method further includes forming a second insulating layer on the plug top.

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Yongin-si, South Korea

Jae-Kyu Lee