Samsung Electro-mechanics Co., Ltd.

Jae Kwang Lee

Seung Wook Park

Young Do Kweon

Seon Hee Moon

Ju Pyo Hong

Jingli Yuan

Joo Young Ha

In Cheol Chang

Sun Mi Sin

A touch screen apparatus includes a mirror part arranged on a side of a quadrilateral touch area, retroreflectors arranged on remaining three sides of the touch area, first and second light transmitting and receiving parts, each being disposed on each of two edges formed by one of the retroreflectors and emitting light to the touch area and detecting reflected light out of the emitted light by the mirror part and the retroreflectors, an angle extracting part calculating a plurality of light emitting angles for a location from which no reflected light is received, by at least one of the first and second light transmitting and receiving parts, and a coordinate generating part calculating a coordinate pair of a location in which light paths corresponding to the plurality of light emitting angles calculated by the angle extracting part intersect with each other.

Touch screen apparatus for determining accurate touch point coordinate pair

A method of manufacturing a dual face package, including: preparing an upper substrate composed of an insulating layer including a post via-hole; forming a filled electrode in a semiconductor substrate, the filled electrode being connected to a die pad; applying an adhesive layer on one side of the semiconductor substrate including the filled electrode, and attaching the upper substrate to the semiconductor substrate; cutting another side of the semiconductor substrate in a thickness direction, thus making the filled electrode into a through-electrode; and forming a post electrode in the post via-hole, forming an upper redistribution layer connected to the post electrode of the semiconductor substrate, and forming a lower redistribution layer connected to the through-electrode on the other side of the semiconductor substrate.

Method of manufacturing a dual face package

A dual face package includes a semiconductor substrate including a through-electrode connected to a die pad disposed on one side of the semiconductor substrate, and a lower redistribution layer disposed on another side thereof and connected to the through-electrode, an insulating layer including a post electrode connected to the through-electrode, and an upper redistribution layer disposed on one side thereof and connected to the post electrode, and an adhesive layer disposed on the one side of the semiconductor substrate so as to attach the insulating layer to the semiconductor substrate such that the through-electrode is connected to the post electrode.

Dual face package having resin insulating layer

Growing community of inventors

Gyunggi-do, South Korea

Jae Kwang Lee