Samsung Electronics Co., Ltd.

Jae June Kim

Kyu Jin Lee

Do Soo Jeong

An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unloading packages which have been stacked and soldered; an indexing system for receiving and aligning the upper and lower individual packages and for transporting the stacked upper and lower packages, an applying unit for applying a solder flux or a solder paste to metal leads of the upper individual packages, first and second transfer tools for transferring the individual packages to the applying unit and to the indexing system; and a heating unit for heating the stacked upper and lower packages so that metal leads of the upper and lower packages are solder jointed.

Automated stacking and soldering apparatus for three dimensional stack

A package for a semiconductor chip including a plurality of input/output pads includes an insulating layer and a plurality of conductive traces. The insulating layer has a first surface for bonding with the surface of the semiconductor chip so that the input/output pads are exposed adjacent the insulating layer. The conductive traces are provided on a second surface of the insulating layer opposite the first surface wherein each of the conductive traces corresponds to a respective one of the input/output pads. In particular, the conductive traces are adapted to receive a plurality of bonding wires each of which corresponds to a respective one of the input/output pads. Accordingly, each of the bonding wires can be bonded at a first end to the respective input/output pad and at a second end to the respective conductive trace. Furthermore, the input/output pads can be on an interior portion of the surface of the semiconductor chip, and the insulating layer can have an opening therein for exposing the input/output pads. Accordingly, a dam on the second surface of the insulating layer can be provided around the opening wherein each of the conductive traces extends from adjacent the opening under the dam to a portion of the insulating layer outside the dam. Related methods and assemblies are also discussed.

Wire bond packages for semiconductor chips and related methods and

A stacking and soldering apparatus for a three dimensional stack package devices includes a first base plate for receiving the first individual package devices to be stacked and having a heater for heating metal lead portions of the first individual package devices and; a second base plate for receiving the second individual package devices to be stacked and having a heater for heating metal lead portions of the second individual package devices. A package loader is used for transferring the individual packages to the first and the second base plates; and a transferring device is used for transferring the first individual package devices in the first base plate to the second base plate. A flux applying tool applies a solder flux to the metal lead portions of the first individual package devices during the transfer from the first to the second base plate; and a pick up tool picks up and places the transferred first individual package devices onto the second individual package devices so that the metal lead portions of the first individual package devices are in contact with the metal lead portions of the second individual package device. A solder joint is formed between the metal lead portions of the two individuals packages, either by thermo-compression of the pick up tool, or by heating of the second base plate.

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Seoul, South Korea

Jae June Kim