Sk Enpulse Co., Ltd.

Hyundai Motor Company

Noroobee Chemical Co., Ltd.

Kia Motors Corporation

Skc Co., Ltd.

Ecoplastic Corporation

Sk Microworks Solutions Co., Ltd.

Jae In Ahn

Jang Won Seo

Kyung Hwan Kim

Sung Hoon Yun

Young Doo Kim

Kang Sik Myung

Jong Ho Lee

Dong Eun Cha

Ki Hong Lee

Hyun Kyung Kim

Seung Yong Lee

Jin Woo Lee

Yong Beom Lee

Jong Wook Yun

Hye Young Heo

Nak Kyoung Kong

Young Seok Kim

Sang Il Kim

Keon Soo Jin

Sung Hun Kim

Phil Jung Jeong

Hyo Jin Lee

Jong Min Park

Dawoo Jeong

Eun Sun Joeng

Dong Jin Lim

Sun Hwan Kim

Ho Tak Jeon

Tae Soo Jung

Jig Gyun Jung

Kang Sik F Myung

Young Chool Kim

Chang Ho Song

Dae Sung Oh

Bock Ceol Lee

The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.

Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same

A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50:4.20≤(|Sv|)/Sz×P (%)≤5.50.

Polishing pad sheet, polishing pad, and method for manufacturing semiconductor device

The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Polishing pad, preparation method thereof and method for preparing semiconductor device using same

The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.

Polishing system, polishing pad and method of manufacturing semiconductor device

The present disclosure provides a polishing pad, which may maintain polishing performances required for a polishing process, such as a removal rate and a polishing profile, minimize defects that may occur on a wafer during the polishing process, and polish layers of different materials so as to have the same level of flatness even when the layers are polished at the same time, and a method for producing the polishing pad. In addition, according to the present disclosure, it is possible to determine a polishing pad, which shows an optimal removal rate selectivity along with excellent performance in a CMP process, through the physical property values of the polishing pad without a direct polishing test.

Polishing pad, method for producing the same and method of fabricating semiconductor device using the same

Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.

Colorless and transparent polyamide-imide film, and manufacturing method therefor

Disclosed are a multilayer coating film made from a natural material and a method of producing the same. The multilayer coating film may be produced by forming a multilayer coating film through formation of a color coating film for providing adhesion and color to a cork on the cork material and a clear coating film for realizing texture and supplementing properties on the color coating film. As such, the multilayer coating film may be made from a natural material to diversify the color and gloss of cork as a natural material, to additionally increase marketability of an interior material and provide various appearance, to prevent discoloration due to light (e.g. UV light.) and water permeation, and to enhance durability against abrasion, scratches and the like.

Method of forming multilayer coating film made from natural material

Disclosed are a coating composition applied on a tempered glass, the tempered glass preventing shattering when impacts are applied, and a manufacturing method thereof. The coating composition comprises a caprolactone-modified acryl resin, an acryl polyol, a polyurethane resin and the like, such that the tempered glass has improved strength and the ceramic part can be removed from a conventional tempered glass. Further provided is a vehicle product such as a vehicle glass component, such that passengers in the vehicle can be protected from the shattering of the broken tempered glass.

Shatter-proof glass coating composition, tempered shatter-proof glass using it and method for manufacturing tempered shatter-proof glass

Disclosed is a one coat painting composition comprising a base including a polyester resin in an amount of about 15 to 45 wt %, a first acrylic resin in an amount of about 15 to 25 wt %, and a second acrylic resin in an amount of about 35 to 65 wt % and a coating method thereof. The composition makes it possible to maintain and improve a high gloss finish of a high gloss injection molded substrate through a single primary coating on the substrate and satisfies environment resistant properties of exterior parts, such as adhesiveness, weather resistance, and scratch resistance, and, thus, is widely suitable for use on exterior plastic parts of automobiles.

One coat painting composition for high gloss and coating method thereof

Growing community of inventors

Gyeonggi-do, South Korea

Jae In Ahn