Samsung Electronics Co., Ltd.

Jae Ick Son

Dae Seok Byeon

Bong Soon Lim

A semiconductor device includes a first semiconductor chip including bitlines, wordlines, common source line, first bonding pads, second bonding pads, third bonding pads and memory cells, the memory cells being electrically connected to the bitlines, the wordlines, and the common source line, the first bonding pads being electrically connected to the bitlines, the second bonding pads being electrically connected to the wordlines, and the third bonding pads being electrically connected to the common source line; a second semiconductor chip including fourth bonding pads, fifth bonding pads, sixth bonding pads and an input/output circuit, the fourth bonding pads being electrically connected to the first bonding pads, the fifth bonding pads being electrically connected to the second bonding pads, the sixth bonding pads being electrically connected to the third bonding pads and the input/output circuit being configured to write data to the memory cells via the fourth bonding pads and the fifth bonding pads; a sensing line extending along an edge portion of the first semiconductor chip, an edge portion of the second semiconductor chip, or the edge portion of the first semiconductor chip and the edge portion of the second semiconductor chip; and a detecting circuit in the second semiconductor chip, the detecting circuit being configured to detect defects from the first semiconductor chip, the second semiconductor chip, or both the first semiconductor chip and the second semiconductor chip using the sensing line.

Semiconductor device

A semiconductor device includes a first semiconductor chip, a second semiconductor chip, an input/output circuit, a sensing line, and a detecting circuit. The first semiconductor chip includes bitlines, wordlines, first bonding pads electrically connected to the bitlines, second bonding pads electrically connected to the wordlines, and memory cells electrically connected to the bitlines and the wordlines. The second semiconductor chip includes third bonding pads that are electrically connected to the first bonding pads and fourth bonding pads that are electrically connected to the second bonding pads. The input/output circuit writes data to the memory cells via the third bonding pads. The sensing line extends along edge portions of at least one of the first and second semiconductor chips. The detecting circuit is in the second semiconductor chip and can detect defects from at least one of the first and second semiconductor chips using the sensing line.

Growing community of inventors

Hwaseong-si, South Korea

Jae Ick Son