Skhynix Inc.

Ms Autotech Co., Ltd.

Myungshin Industry Co., Ltd.

Jae Hyung Park

Dong Uk Lee

Seung Geun Baek

Hong Kyo Jin

Tae Kyu Lee

Jae Sin Yang

A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.

Stacked semiconductor device

Provided is a method for manufacturing vehicle parts having ultra-high strength of 500 Mpa or more by using hot stamping. The method includes: forming a heated blank in a press forming apparatus; and taking out the formed blank from the press forming apparatus and consecutively cutting the blank with a trimming die. A blank temperature at the time of trimming may be 150&#xb0; C. to 330&#xb0; C.

Hot stamping method

Growing community of inventors

Gyeonggi-do, South Korea

Jae Hyung Park