Wolfspeed, Inc.

Jae Hyung Jeremiah Park

Alexander Komposch

Sung Chul Joo

Benjamin P Law

Brian William Condie

A semiconductor device package includes a substrate, a silicon (Si) or silicon carbide (SiC) semiconductor die, and a metal layer on a surface of the semiconductor die. The metal layer includes a bonding surface that is attached to a surface of the substrate by a die attach material. The bonding surface includes opposing edges that extend along a perimeter of the semiconductor die, and one or more non-orthogonal corners that are configured to reduce stress at an interface between the bonding surface and the die attach material. Related devices and fabrication methods are also discussed.

Growing community of inventors

Apex, NC, United States of America

Jae Hyung Jeremiah Park