Hynix Semiconductor Inc.

Skhynix Inc.

Jae-hyun Son

Tae Min Kang

Dae Woong Lee

Byoung Do Lee

Yu Hwan Kim

You Kyung Hwang

Chul Keun Yoon

A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Stack package having flexible conductors

A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.

Stack semiconductor package and method for manufacturing the same

Growing community of inventors

Gyeonggi-do, South Korea

Jae-hyun Son