Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Lg Innotek Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Hyundai Mobis Co., Ltd.

Korea Institute of Science and Technology

Lg Display Co., Ltd.

Kia Corporation

Industry-university Cooperation Foundation Hanyang University

Skhynix Inc.

The General Hospital Corporation

Korea Advanced Institute of Science and Technology

Sungkyunkwan University

Seoul Viosys Co., Ltd.

Jae Hyun Park

Sang Wook Kwon

Yun Kwon Park

Young Ho Ryu

Ki Young Kim

Keum Su Song

Chi Hyung Ahn

Bong Chul Kim

Jong Soo Woo

Dong Zo Kim

Yong Il Kim

Byoung Hee Lee

Nam Yun Kim

Kyeong Soo Kim

Seong Jin Lee

Jong Kook Lee

Duk Yong Kim

Chang Wook Yoon

Daewon Ha

Tae Joon Kim

Sungil Park

Da Hye Kim

Dae Wook Kim

Ju Ho Lee

Dong Ho Kim

Beom Sik Kim

Kyo Sung Ji

Chi Back Ryu

Hyun Wook Cho

Tae Sun Chang

Jong Wook Bae

Hyung Bae Kim

Min Hong Kim

Hye Yeon Kim

Sang Kook Kim

Ki Jun Kim

Hyun Jin Kim

Yun Seok Oh

Jin Wuk Kim

Dong Ju Moon

Yo Han Kim

Jin Soup Joung

Wy-Yong Kim

Jin Soo Yeo

Min Jee Kim

Jae Sun Jung

Kyungho Kim

Jong Moo Huh

Tae Hun Kim

Seung Hwan Kim

Ji Won Son

Hyun Jae Lee

Yeo Jin Yoon

Eun Seok Park

Jong Ho Lee

Young Tack Hong

Sang Shin Lee

Sung Hwan Kim

Jae Hoon Choi

Ho Sub Lim

Chan Ho Jung

Sang Do Park

Min Jung Kim

Ki Bum Nam

Min Kyu Kim

Sung Chul Kim

Sun Woo Kim

Jung Mok Park

Su Yeol Lee

Jae Suk Lee

Jung Hyun Cho

Sung Won Lee

Ki Won Lee

Jung Sang You

Dong Wook Lee

Seung Sik Hong

Deok Soo Lim

Yong Hwan Lee

Chang Sik Yoo

Yu Jin Park

Tae Sung Jang

Ju Tae Song

Sung Il Park

Byung Kook Kim

Sang Il Lee

Jun Yong Park

Jeong Eun Song

Young Il Kim

Hee Jun Lee

In Kyu Park

Kyung Joong Yoon

Jun Hyuk Cheon

Jung Soon Shin

Beom Soo Park

Hyeon Sik Kim

Yung Ho Ryu

Kang Bong Seo

Hyoung Chul Kim

Young Jin Moon

Boone Won

An integrated electronic brake apparatus may include: a main control unit configured to receive one or more of an EPB signal, a value from a pedal sensor, a value from a cylinder pressure sensor, or a value from a wheel speed sensor, perform EPB control, drive a main brake valve and a brake motor for main braking of the vehicle according to an operation of a pedal, and drive an additional brake valve for additional braking; an auxiliary control unit configured to receive one or more of the EPB signal, the value from the pedal sensor, or the value from the wheel speed sensor when a driving signal is inputted thereto, perform EPB control, and control the operation of the EPB to perform a pseudo ABS operation; and a connection bus configured to connect the first and second areas mounted in one box, and transfer a signal transmitted/received between the main control unit and the auxiliary control unit.

Integrated electronic brake apparatus and control method thereof

An integrated electronic brake system includes a main control section configured in a first area to receive one or more of a value from a pedal sensor, a value from a cylinder pressure sensor, a value from a wheel speed sensor, or an EPB signal to perform EPB control and drive a main braking valve and a braking motor for the main braking of a vehicle, and to drive an additional braking valve for the additional braking, a sub-control section configured in a second area to receive one or more of the value from the pedal sensor, the value from the wheel speed sensor, or the EPB signal to perform the EPB control and drive the main braking valve and the braking motor through a bypass circuit, and a connection bus connecting the first and second areas mounted in one box to transfer signals between the main and sub-control sections.

Integrated electronic brake system and control method thereof

A semiconductor device includes a fin type pattern extending in a first direction on a substrate, a first gate electrode extending in a second direction intersecting the first direction on the fin type pattern, a source/drain region on a side wall of the first gate electrode and in the fin type pattern, a separation structure extending in the first direction on the substrate, the separation structure including a first trench and being spaced apart from the fin type pattern and separating the first gate electrode, an interlayer insulating layer on a side wall of the separation structure and covering the source/drain region, the interlayer insulating layer including a second trench having a lower surface lower than a lower surface of the first trench, and a contact connected to the source/drain region and filling the first trench and the second trench.

Semiconductor device

A semiconductor device includes: an active pattern extending in a first direction on a substrate; a first lower source/drain pattern and a second lower source/drain pattern provided on the active pattern and spaced apart from each other in the first direction; a first upper source/drain pattern provided on the first lower source/drain pattern; a second upper source/drain pattern provided on the second lower source/drain pattern; and a gate electrode crossing the active pattern and extending in a second direction intersecting the first direction. The gate electrode includes an overlapping portion overlapping the active pattern in a third direction perpendicular to the first direction and the second direction. A length of the overlapping portion in the second direction is less than a length of the first lower source/drain pattern in the second direction.

A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.

Thermoelectric element

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

Lighting-emitting device filament including electrode pads

A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first buffer layer disposed on the first substrate, a first electrode disposed on the first buffer layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second buffer layer disposed on the second electrode, and a second substrate disposed on the second buffer layer, wherein at least one of the first buffer layer and the second buffer layer includes a silicone resin and an inorganic material, and the Young's modulus of at least one of the first buffer layer and the second buffer layer is 1 to 65 MPa.

Thermoelectric device

A touch sensor includes first touch cells disposed in a first touch sensing area, the first touch cells each including a first touch pattern and a first dummy pattern, and second touch cells disposed in a second touch sensing area, the second touch cells each including a second touch pattern and a second dummy pattern. An area of a first dummy pattern area in which the first dummy pattern is disposed is greater than an area of a second dummy pattern area in which the second dummy pattern is disposed.

Touch sensor and display device including the same

Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.

Duct docking device for ventilation seat of vehicle

A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

Multiple-input multiple-output antenna apparatus and heat dissipation device therefor

A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.

Light emitting module and method of manufacturing the same and display apparatus having the same

Provided is a three-dimensional semiconductor device and its fabrication method. The semiconductor device includes a first active region on a substrate and including a plurality of lower channel patterns and a plurality of lower source/drain patterns that are alternately arranged along a first direction, a second active region on the first active region and including a plurality of upper channel patterns and a plurality of upper source/drain patterns that are alternately arranged along the first direction, a first gate electrode on a first lower channel pattern of the lower channel patterns and on a first upper channel pattern of the upper channel patterns, and a second gate electrode on a second lower channel pattern of the lower channel patterns and on a second upper channel pattern of the upper channel patterns. The second gate electrode may include lower and upper gate electrodes with an isolation pattern interposed therebetween.

Three-dimensional semiconductor device and method of fabricating the same

A clock frequency divider circuit and a receiver are provided. The clock frequency divider circuit includes a reset retimer circuit configured to receive a reset signal and a clock signal, output a reset buffer signal of a differential signal pair obtained by buffering the reset signal, and output a reset synchronization signal obtained by synchronizing the reset signal with the clock signal, a clock buffer circuit configured to receive the clock signal and the reset synchronization signal and output a clock buffer signal of a differential signal pair obtained by buffering the clock signal, and an IQ divider circuit configured to output first through fourth output signals having different phases based on the reset buffer signal and the clock buffer signal.

Reset synchronizing circuit and glitchless clock buffer circuit for preventing start-up failure, and IQ divider circuit

A thermoelectric element according to one example of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a first bonding layer disposed on the first insulating layer; a second insulating layer disposed on the first bonding layer; a first electrode disposed on the second insulating layer; a P-type thermoelectric leg and N-type thermoelectric leg, disposed on the first electrode; a second electrode disposed on the P-type thermoelectric leg and N-type thermoelectric leg; a third insulating layer disposed on the second electrode; and a second substrate disposed on the third insulating layer, wherein the first insulating layer is composed of a composite comprising silicon and aluminum, the second insulating layer is a resin layer composed of a resin composition comprising an inorganic filler and at least one of an epoxy resin and a silicone resin, and the first bonding layer comprises a silane coupling agent.

A heat dissipation device for an electronic element includes a first chamber containing a printed circuit board with heating elements, and a second chamber for heat exchange. The second chamber contains a refrigerant injection part and supply part. A heat transfer part between the chambers receives heat from the heating elements and transfers it to the second chamber. A condensing part condenses injected refrigerant. The heat transfer part has evaporation-inducing ribs on its surface exposed to the second chamber, allowing injected liquid refrigerant to be adsorbed and flow downward in a zigzag pattern. This configuration enables efficient heat dissipation through phase changes of the refrigerant as it evaporates and condenses. The device may also include features like specially-shaped condensation ribs, a blower part to improve condensation, and a pressure regulator for the second chamber. This design provides improved heat dissipation performance without increasing device size.

Heat dissipation device for electronic element

Growing community of inventors

Yongin-si, South Korea

Jae Hyun Park