Lg Innotek Co., Ltd.

Plastal Co., Ltd.

Jae Hwa Kim

Seung Yul Shin

Chung Sik Park

Chul Jun Choi

Sung Wuk Ryu

Jae Ik Kim

Heun Gun Shin

Mu Chang Sung

Sung Ho Hong

The present invention relates to a metal-polymer resin composite in which a polymer resin is directly injection-molded to a zinc alloy, a magnesium alloy, or a die-casting part thereof, and thus an injection product is directly bonded to a metal surface, wherein in the case of a hard polymer resin, a tensile strength of the metal and the polymer resin is 30 MPa or greater, and in the case of a soft polymer resin, a tensile strength of the metal and the polymer resin is 20 MPa or greater, and an average helium leakage after 10 times of measurement is 10Pa·m/s or less, and a novel method for preparing the same.

Die-casting metal part-polymer resin composite and method for preparing same

A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.

Printed circuit board

Disclosed is a printed circuit board including a base insulating layer, an upper insulating layer formed on the base insulating layer, a lower insulating layer formed under the base insulating layer. The upper insulating layer has a plurality of first vias filled in the first through holes, respectively, and the lower insulating layer has a second via filled in one second through hole formed through a top and a bottom surface and commonly connected with the first vias.

Printed circuit board and method of fabricating the same

A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.

Growing community of inventors

Seoul, South Korea

Jae Hwa Kim