Hyundai Motor Company

Samsung Electro-mechanics Co., Ltd.

Kia Motors Corporation

Samsung Electronics Co., Ltd.

Lg Innotek Co., Ltd.

Industry-university Cooperation Foundation Hanyang University

Samsung Engineering Co., Ltd.

Hynix Semiconductor Inc.

Kia Motor Corporation

Est Co., Ltd.

Tbo Healthcare Co., Ltd.

Jae Hoon Choi

Suk Hyung Kim

Yong Ho Baek

Yu Seok Kim

Kyung In Min

Do Kyoung Lim

Kyung Ho Kim

Jung Hyun Park

Dong Gun Kim

Hyo Sik Moon

Young Jae Choi

Jung Hyun Cho

Yoon Jun Lee

Byung Ho Kim

Joo Young Choi

Jin Wook Kim

Jin Ho Park

Doo Hwan Lee

Hae Kyu Lim

Yong Hwan Choi

Jun Seok Choi

Bae Kyun Kim

Do Sung Hwang

Jeong Hun Seo

Hee Tae Yang

Jun Ho Bang

Jae Ean Lee

Beom Joo Kwon

Se Woong Paeng

Ye Jeong Kim

Jung Je Woo

Sang Kun Kim

Hyun Soo Park

Sung Woo Han

Dong Il Kim

Beom Sik Kim

Joung Gul Ryu

Woo Sung Kim

Jong Hu Yoon

Yong Jin Lee

Yong Jae Kim

Eun Sil Kim

Hee Sung Moon

Hui Tae Yang

Dong Sun Kim

Sang Youp Lee

Sang Wook Kwon

Ki Young Kim

Jae Hyun Park

Yun Kwon Park

Young Ho Ryu

Dong Zo Kim

Young Gwan Ko

Yun Ho Kim

Yong Suk Kim

Eun Jeong Jeong

Keum Su Song

Chi Hyung Ahn

Yong Ho Yang

Sang Hyun Lee

Sa Heum Kim

Ki Young Song

Tae Hyuck Kim

Bong Chul Kim

Yoon Cheol Jeon

Jong Chul Choi

Sang Soo Lee

Byoung Hee Lee

Joon Sung Kim

Chang Ryong Heo

Ho Jun Lee

Jae Hyung Park

Rak Jun Choi

Mi Ok Kim

Jae Chul Om

Hae Jin Park

Da Hee Kim

Ki Seung Baek

Jong Seo Yoon

Byung Su Kim

Woo Jin Shin

Byeoung Jo Kim

Dong Gil Ha

Bong Yeon Choi

Hyun Chul Lim

Bo Ram Yang

Eun Seok Kim

Eung Suek Lee

Jun Seok Lee

Hea Sung Kim

Ga Won Lee

Ji Won Chun

Dong Ii Kim

Il Jong Seo

Wang Gi Hong

Buem Yeon Lee

Jong Kuk Hong

Dae Soo Park

Hyung Soo Park

Byung Jo Jeong

Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S).

Method and apparatus for reusing wastewater

Provided are an ammonia decomposition catalyst and a method of decomposing ammonia. The ammonia decomposition catalyst includes an activated carbon carrier and a metal loaded on the carrier, wherein a Brunauer, Emmett and Teller (BET) specific surface area of the carrier is about 850 m/g or more, and the metal includes cerium (Ce).

Ammonia decomposition catalyst and method of decomposing ammonia using the catalyst

An integrated hospital logistics management system and an integrated hospital logistics management method using same is provided. Artificial intelligence analyzes trends and seasonal trends by using big data and predicts actual usage by using an artificial intelligence technology, and an artificial intelligence system automatically processes reorders, replacements, etc., thereby ensuring that an appropriate safety stock level can be maintained at all times according to a stock quantity, stock state, issue quantity, etc. of hospital supplies. The integrated hospital logistics management system includes an order processing module which processes ordering and warehousing of supplies; a logistics management module which requests the order processing module to purchase or replace the supplies according to the states of the supplies; and a system control module including a machine learning unit which generates and learns rules about the operation of the supplies by using metadata.

Integrated hospital logistics management system using AI technology, and integrated hospital logistics management method using same

There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Printed circuit board and manufacturing method thereof

A battery module for a vehicle includes a cell module in which battery cells are overlapped with each other while having a predetermined directivity, and a cooling channel module directly bonded to at least one surface parallel to an overlap direction of the battery cells of the cell module, the cooling channel module having a refrigerant circulated therein, where a cell bonding surface of the cooling channel module has a wave-shaped cross section curved along a curvature formed by end portions of the overlapped battery cells.

Battery module for vehicle

A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.

Semiconductor package

A millimeter wave band array antenna is disclosed. The disclosed antenna includes: a first dipole array antenna unit including first +dipole members, formed on an upper portion of a first substrate and provided with feed signals through a first feed line, and first &#x2212;dipole members, formed on a lower portion of the first substrate and joined with a ground plane on a lower portion of the first substrate; and a slot antenna unit including slot radiators, which are formed on an upper portion of the first substrate, where the ground plane includes a first sloped structure having an upward slope of a first angle to the right from the point of junction with a first &#x2212;dipole member and a second sloped structure having an upward slope of the first angle toward the left from the point of junction.

Millimeter wave band array antenna

A system for managing a battery of a vehicle includes a battery, a main relay connected to the battery to transfer or block power of the battery to components in the vehicle, and a controller. The controller is configured to control the components in the vehicle to be in a power-off (IG OFF) state and turning off the main relay when receiving a vehicle power-off input, and to determine whether or not the battery is abnormal by calculating a parameter for determining a state of the battery and comparing the calculated parameter with a plurality of reference values that are preset.

System and method for managing battery of vehicle

A method for charging a battery may include: obtaining a state of health of the battery and a magnitude of an initial charging current preset for the battery; converting the magnitude of the initial charging current on the basis of the state of health of the battery, thereby generating a charging current command; and providing the charging current command to a charger, and supplying a charging current corresponding to the charging current command to the battery by the charger.

System and method for charging battery

A braking control system for a vehicle is provided. The system includes a motor providing rotational force to wheels of the vehicle and a first battery storing electric energy for driving the motor. An inverter is connected to the first battery via a DC link terminal and performs a bidirectional power conversion between the DC link terminal and the motor. A DC converter is connected to the DC link terminal to down-convert a voltage of the DC link terminal and output the down-converted voltage. A second battery is supplied with the voltage converted by the DC converter and has a voltage lower than that of the first battery. A controller operates the inverter and the DC converter to charge regenerative braking energy generated from the motor during braking of the vehicle in the first battery and the second battery.

Braking control system and method for vehicle

A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.

A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

A power supply system of a vehicle is provided. The system includes a high-voltage battery for storing power and a power relay that is disposed between the high-voltage battery and an electric load. A first converter receives the power from the high-voltage battery through the power relay and a second converter bypasses the power relay to directly receive the power from the high-voltage battery. The electric load receives the power from at least any one of the first converter and the second converter.

Power supply system of vehicle and method of controlling the same

A semiconductor package includes a connection member having first and second surfaces opposing each other and including at least one insulating layer and redistribution layer, the redistribution layer including a via penetrating through the insulating layer and a RDL pattern connected to the via while being located on an upper surface of the insulating layer; a semiconductor chip disposed on the first surface and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface and encapsulating the semiconductor chip. The redistribution layer includes a seed layer disposed on a surface of the insulating layer and a plating layer disposed on the seed layer. An interface between the insulating layer and a portion of the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more.

Growing community of inventors

Yongin-si, South Korea

Jae Hoon Choi