Asyst Technologies, Inc.

Molecular Imprints, Inc.

Jae Hong Kim

Daniel Babbs

William John Fosnight

Matt W Coady

Byung-Jin Choi

Philip D Schumaker

Angelo Fancello

Matthew Coady

Timothy Ewald

The present is directed towards an imprint lithography system including, inter alia, a docking plate; a motion stage having a range of motion associated therewith, the range of motion having a periphery spaced-apart from the docking plate a first distance; and a body, having first and second opposed sides spaced-apart a second distance, selectively coupled between the docking plate and the motion stage, the first distance being greater than the second distance to minimize a probability of a collision between the docking plate, the motion stage and the body while transferring the body between the docking plate and the motion stage.

System to transfer a template transfer body between a motion stage and a docking plate

The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Edge grip aligner with buffering capabilities

A dual paddle end effector robot is disclosed which is capable of parallel processing of workpieces. The end effector includes a lower paddle rotatably coupled to an end of the distal link, and an upper paddle rotatably coupled to the lower paddle. The lower paddle supports a drive assembly capable of rotating the upper paddle with respect to the lower paddle. In one embodiment of the present invention, the dual paddle end effector robot may be used within a wafer sorter to perform parallel processing of workpieces on a pair of aligners within the sorter. In such an embodiment, the robot may first acquire a pair of workpieces from adjacent shelves within the workpiece cassette. After withdrawing from the cassette, the respective paddles on the end effector may fan out and transfer the wafers to the chucks of the respective aligners. After processing of the workpieces on the aligners is complete, the fanned end effector paddles may re acquire the workpieces, the upper paddle may return to its home position located directly over the lower paddle, and then return the processed workpieces to their original cassette or to a new cassette. Parallel processing of workpieces in this fashion provides significantly greater throughput than in conventional wafer sorter systems. Throughput may be improved still further by providing buffering locations for the workpieces at the respective aligners.

System for parallel processing of workpieces

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Austin, TX, United States of America

Jae Hong Kim