Avaya Inc.

Lucent Technologies Inc.

Avaya Technology LLC

At&t Laboratories, Limited

Jae Hong Choi

Mark Dee Woolley

James Erin Evans

Chen-chieh Lin

Ronald Dale Hernandez

Jerald L Golmanavich

Carl J Tiegelmann

William Mitchel Gibbs

Matthew Gilhousen

Barry B Hofmaster

Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.

Non-destructive thermal conductivity detection of solder voids

The present invention provides an image enhancer that can be applied to various materials during quality testing. The image enhancer is adapted to infiltrate cracks, crevices, fractures, fissures, and other faults, defects, or flaws in the material and provide an increased contrast for images taken by, for example, an X-ray imaging device.

Method to enhance X-ray and optical images and locate nano-scale cracks in electric devices and components

A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

Testing BGA solder joints by localized pulsed-heat thermography

A tilt mechanism is provided for a communication device enabling the communication device to be placed at a desired angular position during use. The tilt mechanism includes a biasing member that allows the user to consistently and easily set the angular position of the phone and without collapse or shifting of the communication device to another position. In the preferred embodiments, the biasing member is in the form of a leaf spring that biases the movement of a user-controlled component for setting the desired angular position.

Tilt mechanism for communication device

A runner system and runner component particularly adapted for use in multiple cavity injection molding systems is disclosed. The runner system and runner component utilize particular structural features and geometrical configurations that have been found to result in superior molding practices and molded components in multiple cavity injection molding systems. A corresponding multiple cavity injection molding system utilizing the noted runner system is described. And, a related method for promoting uniform filling of multiple mold cavities is also disclosed.

Apparatus for multiple cavity injection molding

A method for laser marking one or more colors on a plastic substrate is disclosed. A polymeric blend or mixture comprising two or more polymeric systems is utilized to produce a molded component. The various polymeric systems are heated to form a polymeric blend or mixture that is in a molten flowable state. The polymeric mixture is then shaped into the desired end product, preferably by injection molding. While molding, the polymeric mixture separates according to the different densities of the polymers; with the lightest density polymers migrating toward the inner surface of the mold and the heavier density polymers centralizing within the interior of the mold. The lightest density polymer forms the outer surface of the molded product, which may essentially constitute an outer layer coating disposed around the other polymeric systems. Upon removal of the cured layered product, the skin layer is then preferably ablated using a laser to expose the polymers of desired color beneath the outer layer. Other layers within the molded product may be ablated. Ablation may be performed to form a desired design in multiple colors. Other techniques for removing polymeric material in one or more layers are contemplated.

Method of laser marking one or more colors on plastic substrates

A laser markable Acrylonitrile-Butadiene-Styrene (ABS) terpolymer formulation suitable for a number of applications and in particular, telecommunications terminals and keypads. The ABS terpolymer comprises Acrylonitrile (20-24%), Butadiene (14-17%), Styrene (59-63%), Medium Color Furnace Black (0.008-0.015 PPH), Iron Oxide Red (0.003-0.005 PPH), Titanium Dioxide (0.6-3.50 PPH), Silicon Dioxide (0.07-0.2 PPH), Zinc Carbonate (0.05-0.70 PPH) and Aluminum Hydroxide (0.05-0.25 PPH). The ABS so produced is characterized by desirable performance characteristics, e.g., mechanical strength, impact resistance, gloss, stain resistance, molding processing properties and color, as defined in a 3D color system of the color value (L-star (=67.53)), hue (a-star (=1.15)), chroma (b-star (=3.46)).

Laser markable acrylonitrile-butadiene-styrene polymer for

A substantially warp-free laminate polymeric film structure is obtained by a fabrication process in which the individual layers of polymeric film that are to be laminated together to form a card or similar structure are selected such that the mechanical properties of one layer or pair of layers are offset by those of another layer or layer pair wherein each polymeric film layer is bonded to its adjacent polymeric film layers by adhesive layers wherein the adhesive layers have a tack point temperature that is within 10.degree. C. of the glass transition temperature of said polymeric film layers. The properties of the layers which may be subject to this consideration include, for example, the layer thickness, tensile strength, elongation factor, shrinkage rate, and machine processing direction. In an illustrative three-layer substrate embodiment of the present invention, the tensile strength, elongation factor, and shrinkage rate of the outer film layers of the substrate are the same, with the outer layers having a higher tensile strength value than the inner layer tensile strength. The orientation of the film's processing and machine direction and the orientation of the coil set of the film are also considered in arriving at a matched layer set.

Multilayer structures and process for fabricating the same

A wide variety of products are formed by compression molding of silicone materials. Although such articles are used in numerous applications, compression molding is expensive and exudation of unreacted monomers and oligomers tend to cause electrical contact failures. By employing specific polyurethanes formed from polyols and isocyanates, it is possible to form articles by reaction injection molding. This process is substantially cheaper than compression molding and yet the same properties obtainable with silicones are attained.

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Carmel, IN, United States of America

Jae Hong Choi