Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Goldstar, Co., Ltd.

Other

Yonsei University

Amkor Technology, Inc.

Snur & Db Foundation

Optix Co., Ltd.

Jae Ho Shin

Yang Je Lee

Dek Gin Yang

Hun Joo Hahm

Dae Yeon Kim

Chang Ho Shin

Dong Gi An

Young June Jeong

Hyung Suk Kim

Ga Young An

Dong Hyun Cho

Chul Hee Yoo

Jae Woong Choi

Jong Won Lee

Min Woo Lee

Ju Ho Kim

Seung Min Song

Se Woong Cha

Hun Sik Kang

Seung Sang Hwang

Sang Oak Woo

Sang Hoon Park

Joo Hwan Jung

Geun Won Lim

Joong Shik Shin

Seung Ryeol Lee

Jun Oh Hwang

Kwang Suk Park

Yun Je Ji

Dong Hyun Bae

Ha Il Kim

Kang Min Kim

HyunJoo Choi

Kyung Jin Heo

Seung Gweon Lee

Eung Chan Lee

Hyung Ju Cho

Kwang Sun You

Ki Hyun Yoo

Joong Hyuk Jung

Myung June Jung

Sang Gun Kim

Jee Hoon Kim

A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO, SiN, and SiCN.

Printed circuit board and method of manufacturing the same

An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.

Electronic component embedded substrate

A printed circuit board includes a wiring board including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers, a first die embedded in the plurality of insulating layers, a bridge embedded on the first die in the plurality of insulating layers, a second die mounted on the wiring board, and a third die mounted on the wiring board.

Printed circuit board

An operating method of a computational storage device includes: setting a first computing namespace, including a first queue and a first accelerator and having a first value as its first ID, per instructions from a first host; setting a second computing namespace, including a second queue and a second accelerator and having a second value as its first ID, per instructions from a second host; loading a first program from the first host in the first computing namespace; loading a second program from the second host in the second computing namespace; setting a second ID of the first computing namespace to a third value based on an ID of the first program per instructions to activate the first program; and setting the second ID of the second computing namespace to a fourth value based on an ID of the second program per instructions to activate the second program.

Computational storage device and method of operating the same

The present disclosure relates to a printed circuit board. The printed circuit board includes a plurality of insulating layers each having a plurality of concave portions; a plurality of conductor pattern layers disposed in a plurality of concave portions of each of the plurality of insulating layers; first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other. An average width of the first via conductor is greater than that of the second via conductor on a cross-section.

Printed circuit board with plurality of condctor patterns and vias

An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first through portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.

A nonvolatile memory device with improved product reliability and a method of fabricating the same is provided. The nonvolatile memory device comprises a substrate, a first mold structure disposed on the substrate and including a plurality of first gate electrodes, a second mold structure disposed on the first mold structure and including a plurality of second gate electrodes and a plurality of channel structures intersecting the first gate electrodes and the second gate electrodes by penetrating the first and second mold structures, wherein the first mold structure includes first and second stacks, which are spaced apart from each other, and the second mold structure includes a third stack, which is stacked on the first stack, a fourth stack, which is stacked on the second stack, and first connecting parts, which connect the third and fourth stacks.

Nonvolatile memory device with h-shaped blocks and method of fabricating the same

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

Printed circuit board and electronic device comprising the same

A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.

Rigid-flexible printed circuit board and electronic component module

The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.

Printed circuit board, display device comprising the same, and manufacturing method for the same

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Multilayer rigid flexible printed circuit board and method for manufacturing the same

Disclosed is a method of manufacturing a metal matrix composite in which oxide nanoparticles are dispersed. Metal matrix composite powders in which oxide nanoparticles are dispersed are prepared. Gibbs free energy of the oxide nanoparticles is greater than that of an oxide of a metal matrix. A bulk processed material is manufactured from the composite powders through hot forming or a cast material is manufactured by inputting the composite powder into a molten base metal and then rapidly stirring a resultant mixture. The bulk processed material or the cast material is heat-treated so that atoms of the metal matrix and atoms of the oxide nanoparticles mutually diffuse. Oxygen atoms originating from the oxide nanoparticles are diffused and dispersed in the metal matrix.

Oxygen atom-dispersed metal matrix composite and method of manufacturing the same

A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Method of manufacturing rigid-flexible printed circuit board

Growing community of inventors

Daejeon, South Korea

Jae Ho Shin