Stats Chippac Pte. Ltd.

Jae Han Chung

DeokKyung Yang

In Sang Yoon

HyungSang Park

A Leam Choi

HeeJo Chi

HanGil Shin

HeeSoo Lee

Hyeog Chan Kwon

YoungChul Kim

Jong Wook Ju

Oh Han Kim

Junwoo Myung

JoungIn Yang

Taeg Ki Lim

HyungMin Lee

Hyun Joung Kim

Sell Jung

Bongsuk Choi

Tae Sung Jeong

Yeonglm Park

Gwangjin Kim

DokOk Yu

Keon Teak Kang

Hoon Jung

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.

Integrated circuit packaging system with heatsink cap and method of manufacture thereof

An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.

Integrated circuit packaging system with heat spreader and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation.

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system.

Integrated circuit package system with step mold recess

A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.

Integrated circuit package system with planar interconnects

An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.

Integrated circuit with step molded inner stacking module package in package system

An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed.

Integrated circuit package-on-package system with central bond wires

A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.

Growing community of inventors

Ichon-si, South Korea

Jae Han Chung