Lg Semicon Co., Ltd.

Hyundai Electronics Industries Co. Ltd.

Jae Gyung Ahn

Jeong Hwan Son

Hyun S Hwang

Jeong Mo Hwang

Young Gwan Kim

Sung Kwon Hong

Myoung Goo Lee

A method of fabricating a semiconductor device or a substrate having a cell region and a peripheral region includes the step of selectively forming a trench between the cell region and the peripheral region, and forming an isolation layer in the trench. Next, a plurality of gate electrodes are formed on the semiconductor substrate. Lightly doped regions are formed in the semiconductor substrate using the gate electrodes as a mask. Spacers are formed on sides of each of the gate electrodes. A first insulating layer is formed on the cell region of the semiconductor device such that surfaces of the gate electrodes on the cell region remain exposed. A conductivity of the peripheral region of the semiconductor substrate is altered using the first insulating layer, the gate electrodes and the spacers as a mask. Silicide layers are formed on the peripheral region of the substrate and the gate electrodes. A planarization layer is formed on the overall surface of the device, including the silicide layer, and contact holes are formed to expose portions of the cell and peripheral regions of the substrate. Finally, a plurality of bit lines are formed on the second insulating layer, the bit lines extending into the contact holes.

Method of fabricating a semiconductor device with silicided gates and peripheral region

A method for manufacturing a semiconductor device improves hot carrier characteristic in a device having a thick gate insulating film without being affected by short channel effect, thereby improving reliability of the device. The method for manufacturing a semiconductor device includes the steps of forming gate electrodes having gate insulating films of different thicknesses on a semiconductor substrate, implanting a low-concentration impurity ion into the semiconductor substrate at both sides of the gate electrodes, implanting a nitrogen ion into a portion, where the low-concentration impurity ion is implanted, in the gate insulating film relatively thicker than the other gate insulating film, forming sidewall spacers at both sides of the gate electrodes, and implanting a high-concentration source/drain impurity ion into the semiconductor substrate.

Method for manufacturing semiconductor device

An ESD (Electro-Static Discharge) protection circuit includes a semiconductor substrate having an active region and field regions, isolating films formed in the field regions, a gate insulating film formed on the active region, and a gate electrode formed on the gate insulating film, first and second heavily doped impurity regions formed in a surface of the semiconductor substrate at sides of the gate electrode, a plurality of dummy gate electrodes formed on the second heavily doped impurity region and offset from the gate electrode, insulating sidewalls formed at the sides of the gate electrode and at sides of each of the dummy gate electrodes, and salicide films formed on a surface of the gate electrode, on surfaces of each of the dummy gate electrodes and on a surface of the first heavily doped impurity region.

ESD protection circuit and method for fabricating same using a plurality

A method of fabricating a semiconductor device includes the steps of preparing a semiconductor substrate having a first region and a second region, forming a first gate electrode and a second gate electrode over the semiconductor substrate at the first and second regions, respectively, implanting a first impurity ion into the substrate of the first region using the first gate electrode as a mask, implanting a second impurity ion into the substrate of the second region using the second gate electrode as a mask, forming sidewall spacers at both sides of each of the first and second gate electrodes, and implanting the second impurity ion into the first and second regions using the first and second gate electrodes and the sidewall spacers as masks.

Method of fabricating a semiconductor device

A method of fabricating an MOS device that includes self-aligned suicides, the method including two amorphization implantations, both of which follow formation of the self-aligned source/drain regions of the device but precede formation of the self-aligned suicides. The first consists of implantation of low-energy heavy ions, preferably of energies 15-20 keV, while the second consists of implantation of more energetic heavy ions, preferably of energies at least 40 keV.

Method of fabricating a MOS device with a salicide structure

A method for fabricating a semiconductor device having a substrate includes the steps of defining a first region and a second region in the substrate, forming a gate insulator over the substrate at each of the first and second regions, forming a gate electrode over the gate insulator and forming impurity regions in the substrate at adjacent sides of the gate electrode in each of the first and second regions, forming a first insulating layer on top and at sides of the gate electrode in the first region, forming a second insulating layer on the first insulating layer at the first region and on the gate electrode of the second region, removing the second insulating layer by selective etching and forming gate sidewalls at the second region, and forming lightly doped drain areas by injecting ions using the gate sidewalls at the second region and the second insulating layer at the first region as masks.

Growing community of inventors

Chungcheongbuk-do, South Korea

Jae Gyung Ahn