Samsung Electronics Co., Ltd.

Jae Gil Lim

Joo Hyung Lee

Chan Hee Jeong

Hyun Ki Seo

A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.

Growing community of inventors

Cheonan-si, South Korea

Jae Gil Lim